Patent classifications
G01R31/2844
Dynamically configurable remote instrument interface
A connection interface for connecting one or more devices under test (DUTs) to one or more remote test and measurement instruments includes a device-under-test connector for connecting a DUT to the interface, a host-instrument connector for connecting the interface to a host test and measurement instrument, and an electrical path between the device-under-test connector and the host-instrument connector. The connection interface also includes a display that has a first portion visually associated with the device-under-test connector and configured to display an identifier for a particular connection point on the DUT. In some embodiments, the first portion of the display is configured to display measurement data from the particular connection point on the DUT. In some embodiments, the display has a second portion that is configured to display information related to the host test and measurement instrument, or to display a name for a particular measurement of the DUT.
TEST BOARD AND A DEVICE TESTING APPARATUS USING THE TEST BOARD
A test board is provided including a first branch line including a first portion which receives an input signal and a second portion opposite to the first portion. A plurality of second branch lines branch from the first branch line. Each of the second branch lines include a third portion connected to the second portion of the first branch line and a fourth portion connected to the third portion. A first characteristic impedance of the first portion of the first branch line is different from a second characteristic impedance of the second portion of the first branch line. A third characteristic impedance of the third portions of each of the second branch lines is different from a fourth characteristic impedance of the fourth portions of each of the second branch lines. The second characteristic impedance is equal to a combined characteristic impedance of the third portions of each of the second branch lines.
Chip testing method and an apparatus for testing of a plurality of field emission light sources
The present invention generally relates to a method for operating a plurality of field emission light sources, specifically for performing a testing procedure in relation to a plurality of field emission light sources manufactured in a chip based fashion. The invention also relates to a corresponding testing system.
Current leakage and charge injection mitigating solid state switch
Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.
A CHIP TESTING METHOD AND AN APPARATUS FOR TESTING OF A PLURALITY OF FIELD EMISSION LIGHT SOURCES
The present invention generally relates to a method for operating a plurality of field emission light sources, specifically for performing a testing procedure in relation to a plurality of field emission light sources manufactured in a chip based fashion. The invention also relates to a corresponding testing system.
Common test board, IP evaluation board, and semiconductor device test method
According to one embodiment, there is provided a common test board including a socket board, an IP evaluation board, and a common board. To the socket board, a semiconductor device is to be connected. On the IP evaluation board, the socket board is able to be attached. On the common board, the IP evaluation board is able to be attached.
Multifunctional substrate inspection apparatus and multifunctional substrate inspection method
Provided is a multifunctional substrate inspection apparatus capable of selectively bringing probes into contact. The apparatus is provided with first and second probe bases 100, 200 to which probes 111-217 having different lengths and capable of contacting surfaces 10, 20 of a substrate 30, driving device 50 increasing and decreasing an interval between the first and second probe base 100, 200, an intermediate plate 300 capable of carrying the substrate 30 between the first and second probe bases 100, 200, a first extendable pole or equivalent support mechanism attached to the first probe base 100 and capable of pressing the substrate 30 with a biasing force F1 based on a driving force F of the driving device 50 transmitted via first biasing device 61, second biasing device 42 for urging the substrate 30 to be inspected away from the intermediate plate 300, and third biasing device 43 for urging the intermediate plate 300 away from the second probe base 200, the probes 111-217 being selectively brought into contact with the substrate 30 according to their different lengths.
CONDENSATION PREVENTION TYPE TRANSMISSION WINDOW FOR CMS MODULE TEST CHAMBER
The present invention is related to a condensation prevention type transmission window for a CMS module test chamber, the transmission window being provided at the module test chamber. The condensation prevention type transmission window includes: a multilayer glass panel in which heating wires are coated on upper, lower, left, and right side surfaces thereof; and an air injector provided at each of opposite surfaces of the transmission window to inject air from an upper side edge and/or a lower side edge of the transmission window and to form an air curtain. The present invention provides the condensation prevention type transmission window for a CMS module test chamber, which prevents freezing and fogging on inside and outside surfaces of the transmission window of the CMS module test chamber varying in a temperature range from 40 C. to +125 C.
SYSTEM AND METHOD FOR FORMAL FAULT PROPAGATION ANALYSIS
A system and method for formulating a sequential equivalency problem for fault (non)propagation with minimal circuit logic duplication by leveraging information about the location and nature of a fault. The system and method further apply formal checking to safety diagnoses and efficiently models simple and complex transient faults.
Automatic Selection of Connecting Cables for In-line Test
An apparatus includes an interface to a device-under-test (DUT), an interface to a rack of cable holders, and a control circuit. Each cable holder is configured to raise or lower respective cable. The control circuit is configured to determine an internal configuration of the DUT and, based upon an internal configuration of the DUT, identify a plurality of cables to be used in testing the DUT. The control circuit is configured to cause the rack of cable holders to actuate a plurality of the cable holders associated with the identified plurality of cables to raise or lower the cable holders associated with the identified plurality of cables.