There are provided a photosensitive resin composition, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product. This photosensitive resin composition is cured by irradiation with active energy rays, instead of by heat treatment at high temperatures. In this photosensitive resin composition, film loss after a development process is restrained. Furthermore, a miniaturized pattern can be accurately formed by photolithography. An aspect of the present invention is a photosensitive resin composition including components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product.

Provided are patterned films comprising nanostructures and one or more UV-cured monomers. Also provide are methods of making the patterned films, and electroluminescent devices comprising the patterned films.

Provided are patterned films comprising nanostructures and one or more UV-cured monomers. Also provide are methods of making the patterned films, and electroluminescent devices comprising the patterned films.

The present invention relates to a curable coating composition, especially a radiation curable coating composition comprising at least one poly(meth)acrylate compound comprising at least 6 (meth)acrylate groups, at least one unsaturated silane compound, and at least one photoinitiator. Said at least one poly(meth)acrylate compound comprising at least 6 (meth)acrylate groups and said at least one unsaturated silane compound represent at least 95% of the weight of polymerizable compounds present in the composition. Upon radiation-curing, the composition provides an abrasion- and/or scratch-resistant coating.

There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.

There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.

A negative working, aqueous base developable, photosensitive photoresist composition and a process of using this composition to produce lithographic images, where this composition is one comprising: a) a polymer containing the four repeat units of structures (1), (2), (3), and (4), but no other types of repeat units; wherein v, x, y and z, respectively, represent the mole % of each repeat units of structures (1), (2), (3) and (4); b) a radical photo-initiator component, which is comprised of at least one radical photo initiator which is activated by a broad absorption of radiation from about 360 nm to about 440 nm; c) a crosslinker component which is either a mixture consisting of crosslinkers of structure (5), (6) and (7), or a single crosslinker of structure (8); d) a radical inhibitor component; e) an optional surfactant component; f) an optional dissolution promoter component; and g) a solvent. The invention also relates to the process of using this negative resist to produce lithographic images. ##STR00001##

A negative working, aqueous base developable, photosensitive photoresist composition and a process of using this composition to produce lithographic images, where this composition is one comprising: a) a polymer containing the four repeat units of structures (1), (2), (3), and (4), but no other types of repeat units; wherein v, x, y and z, respectively, represent the mole % of each repeat units of structures (1), (2), (3) and (4); b) a radical photo-initiator component, which is comprised of at least one radical photo initiator which is activated by a broad absorption of radiation from about 360 nm to about 440 nm; c) a crosslinker component which is either a mixture consisting of crosslinkers of structure (5), (6) and (7), or a single crosslinker of structure (8); d) a radical inhibitor component; e) an optional surfactant component; f) an optional dissolution promoter component; and g) a solvent. The invention also relates to the process of using this negative resist to produce lithographic images. ##STR00001##

Described herein are photopolymerizable compositions for use in 3D printing. The compositions contain dipropylene glycol diacrylate and one or more urethane acrylate oligomers, optionally with a photoinitiator. Also described are methods for fabricating three dimensional objects utilizing these compositions, and three dimensional objects made from these compositions.

A display device includes a sacrificial layer positioned between an encapsulation layer and a light-emitting element that includes a first compound that is the same as a first compound of a light-emitting layer of the light-emitting element, thereby protecting the light-emitting element from an outgas of the encapsulation layer to prevent the generation of dark spots.