A display device includes a sacrificial layer positioned between an encapsulation layer and a light-emitting element that includes a first compound that is the same as a first compound of a light-emitting layer of the light-emitting element, thereby protecting the light-emitting element from an outgas of the encapsulation layer to prevent the generation of dark spots.

A blue curable resin composition includes a colorant (A), a resin (B), a polymerizable compound (C) and a polymerization initiator (D). The colorant (A) includes two or more pigments each having a phthalocyanine backbone. The blue curable resin composition has relatively low in Bx and is high in intensity in an xy chromaticity diagram of an XYZ color system. A color filter may be formed from the blue curable resin composition. The blue curable composition may be also used in a display device.

A blue curable resin composition includes a colorant (A), a resin (B), a polymerizable compound (C) and a polymerization initiator (D). The colorant (A) includes two or more pigments each having a phthalocyanine backbone. The blue curable resin composition has relatively low in Bx and is high in intensity in an xy chromaticity diagram of an XYZ color system. A color filter may be formed from the blue curable resin composition. The blue curable composition may be also used in a display device.

Disclosed herein is a photosensitive composition comprising an epoxy resin, a photoacid generator, and an antioxidant. The disclosed composition is useful for producing relief images having reduced yellowing or other discoloration due to thermal oxidation.

Disclosed herein is a photosensitive composition comprising an epoxy resin, a photoacid generator, and an antioxidant. The disclosed composition is useful for producing relief images having reduced yellowing or other discoloration due to thermal oxidation.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

A liquid photosensitive ink composition capable of forming a cured product with a high refractive index and a high transparency, a cured product of the photosensitive ink composition, a display panel having a film consisting of the cured product, and a method for producing the cured product using the photosensitive ink composition. In a photosensitive ink composition including a photopolymerizable compound, and a photopolymerization initiator, a sulfide compound having specific structure and a (meth)acrylate compound having specific structure are used as the photopolymerizable compound, and a phosphine oxide compound and an oxime ester compound are used as the photopolymerization initiator.

The present invention provides a photosensitive resin multilayer body which is obtained by superposing, on a supporting film, a photosensitive resin layer containing a photosensitive resin composition that contains from 10% by mass to 90% by mass of (A) an alkali-soluble polymer, from 5% by mass to 70% by mass of (B) a compound having an ethylenically unsaturated double bond and from 0.01% by mass to 20% by mass of (C) a photopolymerization initiator; the alkali-soluble polymer (A) contains a copolymer which contains, as a copolymerization component, a (meth)acrylate that has an alkyl group having from 3 to 12 carbon atoms; an acrylate monomer is contained, as the compound (B) having an ethylenically unsaturated double bond, in an amount of from 51% by mass to 100% by mass relative to the total amount of the compound (B) having an ethylenically unsaturated double bond; the absorbance A of the photosensitive resin layer containing the photosensitive resin composition at a wavelength of 365 nm, said photosensitive resin layer having a film thickness T (μm), satisfies the relational expression 0<A/T≤0.007; and the film thickness of the photosensitive resin layer containing the photosensitive resin composition is from 40 μm to 600 μm.

The present invention provides a photosensitive resin multilayer body which is obtained by superposing, on a supporting film, a photosensitive resin layer containing a photosensitive resin composition that contains from 10% by mass to 90% by mass of (A) an alkali-soluble polymer, from 5% by mass to 70% by mass of (B) a compound having an ethylenically unsaturated double bond and from 0.01% by mass to 20% by mass of (C) a photopolymerization initiator; the alkali-soluble polymer (A) contains a copolymer which contains, as a copolymerization component, a (meth)acrylate that has an alkyl group having from 3 to 12 carbon atoms; an acrylate monomer is contained, as the compound (B) having an ethylenically unsaturated double bond, in an amount of from 51% by mass to 100% by mass relative to the total amount of the compound (B) having an ethylenically unsaturated double bond; the absorbance A of the photosensitive resin layer containing the photosensitive resin composition at a wavelength of 365 nm, said photosensitive resin layer having a film thickness T (μm), satisfies the relational expression 0<A/T≤0.007; and the film thickness of the photosensitive resin layer containing the photosensitive resin composition is from 40 μm to 600 μm.

A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R.sup.1 represents a monovalent organic group having 1 to 30 carbon atoms; and X represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.

R.sup.1—COO.sup.−X.sup.+(1)