G03F7/0955

Method for fabricating photoresist pattern, color filter and display device

The disclosure provides in some embodiments a method for fabricating a photoresist pattern, a color filter and a method for fabricating the same, and a display device. The method for fabricating a photoresist pattern includes coating negative photoresist on a base substrate to form a first photoresist layer, coating positive photoresist on the first photoresist layer to form a second photoresist layer, conducting a first exposure process on first regions of the second photoresist layer, conducting a first developing process to remove the positive photoresist within the first regions of the second photoresist layer and the negative photoresist within second regions of the first photoresist layer, so as to obtain a first photoresist pattern and a second photoresist pattern, conducting a second exposure process on the first photoresist pattern and the second photoresist pattern, and conducting a second developing process to remove the first photoresist pattern.

Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor

A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

TRANSFER FILM, METHOD FOR MANUFACTURING LAMINATE, LAMINATE, ELECTROSTATIC CAPACITANCE-TYPE INPUT DEVICE, AND IMAGE DISPLAY DEVICE
20170157899 · 2017-06-08 · ·

In a transfer film including a temporary support having a thickness of 38 m or less; and a curable transparent resin layer disposed on the temporary support in a direct-contact manner, in which a thickness of the curable transparent resin layer is 5 m or more, the curable transparent resin layer includes a binder polymer, a polymerizable compound, and a polymerization initiator, and a melt viscosity c of the curable transparent resin layer measured at 100 C. is 1.010.sup.3 Pa.Math.s or more, the temporary support and the curable transparent resin layer are in direct contact with each other, and it is possible to prevent the incorporation of air bubbles during lamination on base materials having an elevation difference; a method for manufacturing a laminate; a laminate; an electrostatic capacitance-type input device; and an image display device.

Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor

A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Photopolymerisable layered composite for producing flexo printing elements

Laminate comprising a) a photopolymerizable relief-forming layer, at least containing an elastomeric binder, ethylenically unsaturated monomers and a photoinitiator and optionally further additives, b) an optionally photopolymerizable elastomeric substrate layer, at least containing an elastomeric binder, optionally ethylenically unsaturated monomers and a photoinitiator and optionally further additives,
the relief-forming layer a) having a hardness of 30 to 70 Shore A and the elastomeric substrate layer b) having a hardness of 75 Shore A to 70 Shore D in each case in the photopolymerized state, and the layer b) having a hardness of at least 5 Shore A greater than the layer a).

A METHOD FOR MAKING A LITHOGRAPHIC PRINTING PLATE PRECURSOR
20170075223 · 2017-03-16 ·

A method for making a lithographic printing plate includes the steps of: a) providing a lithographic printing plate precursor including a support having a hydrophilic surface or which is provided with a hydrophilic layer, and a coating provided thereon, the coating including a photopolymerisable layer including a photopolymerisable composition, b) image-wise exposing the precursor, c) optionally heating the precursor, d) developing the precursor by treating the precursor with a gum solution so that the precursor is developed and gummed in one single step, characterized in that the photopolymerisable composition includes a monomer represented by Formula (I) and/or Formula (II):

##STR00001## wherein *denotes the linking positions to the rest of the compound.

PHOTOSENSITIVE RESIN LAMINATE AND APPLICATION THEREOF
20250076763 · 2025-03-06 ·

A photosensitive resin laminate and application thereof are provided. The photosensitive resin laminate consists of two or more photosensitive resin layers and includes a second component, wherein: when the photosensitive resin laminate is characterized by gas chromatography with added toluene as an internal standard, an elution peak of the second component is at a retention time ranging from 0.55 min to 1.30 min, an elution peak of the added toluene is at a retention time ranging from 1.32 min to 1.65 min, and the following formula is satisfied:

[00001] Area of the elution peak of the second component Area of the elution peak of the added toluene Amount of the added toluene Mass of the photosensitive resin laminate 100 % = 0.1 % - 7. % ,

and wherein the amount of the added toluene and the mass of the photosensitive resin laminate are in grams (g); and the photosensitive resin laminate has a total thickness of 100 m to 600 m.

Component carrier with a photoimageable dielectric layer and a structured conductive layer being used as a mask for selectively exposing the photoimageable dielectric layer with electromagnetic radiation

A method for manufacturing a component carrier is disclosed. The method includes the steps of providing a layer stack having at least one component carrier material, forming a photoimageable dielectric layer structure on the layer stack, forming a spatial pattern of an electrically conductive layer structure on the photoimageable dielectric layer structure, wherein the spatial pattern defines openings formed within the electrically conductive layer structure, and exposing the photoimageable dielectric layer structure to electromagnetic radiation, where the spatial pattern of the electrically conductive layer structure represents a mask for selectively exposing predefined regions of the photoimageable dielectric layer structure. Furthermore, the method includes selectively removing material from the photoimageable dielectric layer depending on the spatial pattern.

RESIST TOPCOAT COMPOSITIONS AND METHODS OF FORMING PATTERNS USING THE COMPOSITION
20250284196 · 2025-09-11 ·

Provided are a resist topcoat composition and a method of forming patterns using the resist topcoat composition, the resist topcoat composition including a copolymer including a first structural unit represented by Chemical Formula M-1 and a second structural unit represented by Chemical Formula M-2; a photoacid generator; and a solvent, wherein the photoacid generator is a non-ionic compound or an ionic compound, the non-ionic compound includes an organic sulfonate group, the ionic compound includes at least one selected from a conjugate base of an inorganic acid and a conjugate base of an organic sulfonic acid as an anion.

Component Carrier With Photoimageable Dielectric Layer and Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation
20250349688 · 2025-11-13 ·

A component carrier includes a layer stack having at least one component carrier material, a component at least partially embedded in the layer stack, where the component has at least one metal layer structure; and a photoimageable dielectric layer structure on the layer stack. The photoimageable dielectric layer structure has at least one recess extending vertically through the photoimageable dielectric layer structure up to the at least one metal layer structure of the component.