A three-dimensional semiconductor memory device may include a cell wafer including a source plate, a plurality of first word lines stacked to be spaced apart from one another along a plurality of first vertical channels projecting from a bottom surface of the source plate in a vertical direction, and a plurality of second word lines stacked to be spaced apart from one another along a plurality of second vertical channels projecting from a top surface of the source plate in a vertical direction; a first peripheral wafer bonded to a bottom surface of the cell wafer, and including a first row decoder unit which transfers an operating voltage to the plurality of first word lines; and a second peripheral wafer bonded to a top surface of the cell wafer, and including a second row decoder unit which transfers an operating voltage to the plurality of second word lines.

A memory apparatus and method of operation is provided. The apparatus includes a block having memory cells connected to word lines and arranged in strings and is divided into a first sub-block and a second sub-block each configured to be erased as a whole in an erase operation. The apparatus has a temperature measuring circuit configured to detect an ambient temperature of the apparatus. A control circuit is configured to determine a word line inhibit voltage based on the ambient temperature. The control circuit applies an erase voltage to each of the strings while simultaneously applying a word line erase voltage to the word lines associated with a selected one of the first and second sub-blocks to encourage erasing and the word line inhibit voltage to the word lines associated with an unselected one of the first and second sub-blocks to discourage erasing in the erase operation.

A system performs analog memory sanitization by forcing voltage levels in memory cells to substantially the same voltage level so that they are indistinguishable regardless of the data that has been previously stored in the cells. In some embodiments, a special programming operation for sanitizing a plurality of memory cells forces the charge in the cells to approximately the same voltage level by increasing the voltage level of all cells regardless of the data currently stored in the cells. As an example, each cell may be programmed to a logical high bit value (e.g., a “0”) by increasing the charge in each cell to a voltage level that is greater than the voltage level for writing the same logical bit value in a normal programming operation. Thus, after the programming operation is performed, the voltage levels of cells storing one logical bit value (e.g., a “0”) prior to the programming operation may be indistinguishable from voltage levels of cells storing a different logical bit value (e.g., a “1”) prior to the programming operation.

The embodiments of the disclosure provide a control method and apparatus for a memory, and a storage medium. The memory has memory blocks, and each memory block has memory strings. Each of the memory strings includes a channel layer with an N-type doped top region. In a memory block, a bit line erasing voltage is applied to a select bit line, and an erasing prohibition voltage is applied to an unselect bit line. A top select gate voltage lower than the bit line erasing voltage is applied to a top select gate. When a word line erasing voltage lower than the bit line erasing voltage is applied to the corresponding word line connected to a memory string corresponding to the select bit line and the unselect bit line, the memory string corresponding to the select bit line is erased.

Methods, systems, and devices for overwriting at a memory system are described. A memory system may be configured to overwrite portions of a memory array with new data, which may be associated with omitting an erase operation. For example, write operations may be performed in accordance with a first demarcation configuration to store information at a portion of a memory array. A portion of a memory system may then determine to overwrite the portion of the memory array with different or updated information, which may include performing write operations in accordance with a second demarcation configuration. The second demarcation configuration may be associated with different cell characteristics for a one or more logic states, such as different distributions of stored charge or other cell property, different demarcation characteristics, different write operations, among other differences, which may support performing an overwrite operation without first performing an erase operation.

A storage device and an operating method of the storage device are provided. The storage device comprises a first non-volatile memory device, a second non-volatile memory device, a third non-volatile memory device a storage controller configured to control the first non-volatile memory device, the second non-volatile memory device, and the third non-volatile memory device, control the first non-volatile memory device to extract a first on-cell count value after a first soft erase operation, set first to third read level offsets of the respective first to third non-volatile memory devices based on the respective first to third on-cell count values, select the first to third defense code parameter sets each corresponding to the respective first to third read level offsets, and transmits first to third read commands based on the selected respective first to third defense code parameter sets to the respective first to third non-volatile memory devices.

A data storage device includes a memory device and a controller coupled to the memory device. The controller is configured to determine that a power loss event has occurred, determine that one or more blocks are in an erased state, examine a block of the one or more blocks to determine whether the block is a SLC erased block or a TLC erased block, and place the block in a SLC pre-erase heap if the block is the SLC erased block or in a TLC pre-erase heap if the block is the TLC erased block. The controller is further configured to determine a first bit count of page0 for a SLC voltage for the block, determine a second bit count of page1 for a TLC voltage for the block, and classify the block as either a SLC erased block or a TLC erased block.

A system includes a memory device including a memory array and control logic, operatively coupled with the memory array, to perform operations including causing an erase operation to be performed. The erase operation includes sub-operations. The operations further include causing defect detection to be performed during at least one sub-operation of the sub-operations. The defect detection is performed using at least one defect detection method with respect to at least one failure point.

A request to perform a secure erase operation for a memory component can be received. A voltage level of a pass voltage that is applied to unselected wordlines of the memory component during a read operation can be determined. A voltage pulse can be applied during a program operation to at least one wordline of the memory component to perform the secure erase operation. The voltage pulse can exceed the pass voltage applied to the unselected wordlines of the memory component during the read operation.

A semiconductor memory device includes a plurality of memory blocks and a contact region. Each of the plurality of memory blocks includes a plurality of memory cells. The contact region is formed between the plurality of memory blocks. The semiconductor memory device uses a first memory block that is not adjacent to the contact region and a second memory block adjacent to the contact region among the plurality of memory blocks differently.