A memory cell arrangement for Random Access Memory (RAM) including one or more RAM cell groups. The RAM cell groups having two or more local bit-lines sharing a Global Bit-Line (GBL), a pre-charging circuit connected to the GBL, a multiplexer connected to multiple GBLs and configured to shift an output of a first GBL from a first bit to a second bit at least in part according to a value of a fuse bit register associated with a second GBL, and at least one pre-charge enabling circuit controlled by a combination of a pre-charge input value applied to all GBLs of the memory cell arrangement and a pre-charge enable signal for the GBL.

Various implementations described herein are directed to a device having memory circuitry having bitcells coupled together via bitlines. The device may include polarity swapping circuitry having multiple conductive paths that are configured to couple the bitlines together. In some instances, first paths of the multiple conductive paths couple the bitlines together via first passgates, and second paths of the multiple conductive paths couple the bitlines together via second passgates.

Various implementations described herein are directed to a device having memory circuitry having bitcells coupled together via bitlines. The device may include polarity swapping circuitry having multiple conductive paths that are configured to couple the bitlines together. In some instances, first paths of the multiple conductive paths couple the bitlines together via first passgates, and second paths of the multiple conductive paths couple the bitlines together via second passgates.

Methods, systems, and devices for speculative memory section selection are described. Defective memory components in one memory section may be repaired using repair components in another memory section. Speculative selection of memory sections may be enabled, whereby access lines in multiple memory sections may be selected when a memory command indicating an address in one memory section is received. While the access lines in the multiple memory sections are selected, a determination of whether repair components in another memory section are to be accessed is performed. Based on the determination, the access line in one of the memory sections may be maintained and the access lines in the other memory sections may be deselected.

Methods, systems, and devices for speculative memory section selection are described. Defective memory components in one memory section may be repaired using repair components in another memory section. Speculative selection of memory sections may be enabled, whereby access lines in multiple memory sections may be selected when a memory command indicating an address in one memory section is received. While the access lines in the multiple memory sections are selected, a determination of whether repair components in another memory section are to be accessed is performed. Based on the determination, the access line in one of the memory sections may be maintained and the access lines in the other memory sections may be deselected.

A memory device includes a data storage region and a spare column remap storage. The data storage region includes a plurality of sub-arrays, and each of the plurality of sub-arrays has a plurality of main columns and a plurality of spare columns. The spare column remap storage includes a plurality of storage units storing column address information of a repaired main column of one of the plurality of sub-arrays and address information of a repaired main column of another of the plurality of sub-arrays into at least one of the plurality of storage units included in the spare column remap storage.

A method for determining redundancy usage rate from a group of memory parameters and a memory yield of a System on a Chip (SoC), using the probabilistic redundancy usage rate and using that rate to calculate an optimal RSMA size. An SoC is then fabricated with the optimal RSMA size.

A memory system includes a memory device including a memory cell array including a plurality of memory cell groups, and a controller for selectively activating or inactivating one of the memory cell groups.

A memory cell arrangement for Random Access Memory (RAM) including one or more RAM cell groups. The RAM cell groups having two or more local bit-lines sharing a Global Bit-Line (GBL), a pre-charging circuit connected to the GBL, a multiplexer connected to multiple GBLs and configured to shift an output of a first GBL from a first bit to a second bit at least in part according to a value of a fuse bit register associated with a second GBL, and at least one pre-charge enabling circuit controlled by a combination of a pre-charge input value applied to all GBLs of the memory cell arrangement and a pre-charge enable signal for the GBL.

The present embodiments provide a stacked memory apparatus and a repairing method thereof which store information about a spare resource in a pre-bond process, check a spare resource available in a post-bond process, correct an error through an error correction code, and variably use the same number of spare resources to additionally ensure a number of spare resources in the post-bond process, thereby improving a yield.