Provided is an electrical contactor that is formed from a small number of components that can improve the conductivity in the electrical contactor, while improving the slidability of an elastic member and the electrical contact stability with a contact target. The present disclosure provides an electrical contactor which is formed from a plate-shaped member, the plate-shaped member including: a main body; an upper arm portion; a first tip end portion provided at a tip end of the upper arm portion; a lower arm portion; and a second tip end portion provided at a tip end of the lower arm portion, the electrical contactor including: a first contact portion formed by winding the first tip end portion; a first elastic portion formed by winding the upper arm portion and having a bamboo-shoot-like spring structure; a second contact portion formed by winding the second tip end portion; a second elastic portion formed by winding the lower arm portion and having a bamboo-shoot-like spring structure; and a coupling portion that couples the first elastic portion and the second elastic portion to enable elasticity of each of the first elastic portion and the second elastic portion by winding the main body, in which each or either of a tip end surface of the first contact portion that contacts the first contact target and a tip end surface of the second contact portion that contacts the second contact target is an inclined surface.

A metal probe structure and a method for fabricating the same are provided. The metal probe structure includes a multi-layer substrate, a first flexible dielectric layer, a second flexible dielectric layer, and a plurality of first metal components. The first flexible dielectric layer is disposed over the multi-layer substrate and has a conductive layer formed thereover. The second flexible dielectric layer is disposed over the first flexible dielectric layer to cover the conductive layer. The plurality of first metal components is disposed over the conductive layer and partially in the second flexible dielectric layer to serve as a metal probe.

When a load necessary for inspection is applied to a cylindrical body in the axial direction thereof, an end of the first bar-like main body is located closer to the other end side of the cylindrical body than one end of a support portion in a support member that supports the body portion, an end of the second bar-like main body is located closer to one end side of the cylindrical body than the other end of the support portion, the body portion is located in the entire portion where the support portion is located, and a radial distance between the outer peripheral surface of the axial central portion of at least one of the first spring portion and the second spring portion and the support member is larger than the distance between the body portion and the support portion.

A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.

Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.

A probe testing device having an elastic structure is provided. The probe testing device having the elastic structure includes a plurality of probe elements and a guide plate module. Each of the probe elements includes a body, a first contact segment, and a second segment, and is formed integrally. The guide plate module includes a first guide plate, a second guide plate, and a third guide plate that are parallel to each other, and the third guide plate is arranged between the first guide plate and the second guide plate. The plurality of probe elements correspondingly pass through the first guide plate, the second guide plate, and the third guide plate. The third guide plate is configured to perform a parallel movement relative to the first guide plate and the second guide plate in a direction perpendicular to an axis of the probe element.

The present invention relates to a method for realizing the measuring slip of membrane probe, wherein: an elastomer layer is placed between the rigid acting surface of the membrane probe head and the membrane on which the probe is arranged; on the axial plane of the probe, the elastomer layer takes any axial line passing through the probe as a boundary line, and there is a difference between the thickness of one side and thickness of the other side, so that the probe can deflect during the test, resulting in the measuring slip to penetrate or push away the surface oxide of the tested chip and achieve more stable contact.

A membrane probe card and its probe head, and the membrane probe card comprises a membrane probe head, and the membrane probe head consists of a support, membrane, a probe and an interconnecting wire; a concave supporting structure is arranged between the acting surface of the support and the membrane; the concave supporting structure comprises a concave structure and a supporting elastic layer, and the concave structure comprises one or more concaves, the concave corresponds to the position of the probe and the concaves are eccentric with the corresponding probes; the convex insert of the supporting elastic layer is embedded in the corresponding concave to generate a thickness difference between the two sides of each probe on the supporting elastic layer.

Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.