A plate spring-type connection pin is proposed. The connection pin includes: a support pin that has a bending lip portion at an upper portion thereof and a base portion at a lower portion thereof, and is vertically elongated; a plate spring that has an upper probe portion vertically extending adjacent to the lip portion, a lower probe portion disposed at the same height as the base portion, a laterally lying V-shaped portion disposed between the upper probe portion and the lower probe portion, an upper bending portion connecting an upper end of the V-shaped portion and a lower end of the upper probe portion, and a lower bending portion connecting a lower end of the V-shaped portion and an upper end of the lower probe portion; and a bridge that is disposed between the base portion of the support pin and the lower probe portion of the plate spring.

A contact probe having a first end portion adapted to abut onto a contact pad of a device under test and a second end portion adapted to abut onto a contact pad of a PCB board of a testing apparatus, as well as a rod-shaped probe body extended between the end portions along a longitudinal development direction is provided with an opening extending along the longitudinal development direction and defines at least one pair of arms in the probe body. Suitably, each arm of the at least one pair of arms has a not constant transversal section, which is perpendicular to the longitudinal development direction, having different areas in correspondence of different points along the probe body and ensures a distribution of the stress along the probe body during bending thereof during testing operation of the device under test performed by means of the contact probe.

The present disclosure is directed to an inspection tool having a probe head with a probe card with a plurality of probes for performing testing, each of the probes being configured with a first end attached to the probe card and a second end for engaging microbumps coupled to a semiconductor die, the plurality of probes including a first set of probes having a first cross-sectional dimension, the first set of probes being arranged in a first set of locations on the probe card, and a second set of probes having a second cross-sectional dimension, the second set of probes being arranged in a second set of locations on the probe card, and a stage for holding the semiconductor die.

The invention relates to a high-frequency test connector device (12; 12′) having an adapter housing including a sleeve-like ground contact section (10; 10′) axially at one end, (18) at the other end, and centrally an insulated inner contact (20), wherein the ground contact section has an electrically conducting spring member (26; 26′, 28; 42, 44; 44′, 46) for ground contact, associated such that for engaging over the sleeve section (14) of the contacting partner (16), the latter with an end face (30), to form a contact and resiliently along the movement or connecting longitudinal axis, can engage on the spring member (26) formed in a sleeve base of the ground contact section (10), or wherein, for engaging in the sleeve section (14′) of the connecting partner (16′), the spring member (26′) projects from an end face end section of the ground contact section (10′), to form a contact and resiliently along the longitudinal axis, can engage on a ground-conducting inner section (40) of the connecting partner.

An inspection terminal provided in a test device has a main body portion including a support portion that is curved; a plate-shaped portion integrally connected to the support portion and extending in a first direction; a tip portion integrally connected to the plate-shaped portion and having a larger dimension in a second direction intersecting with the first direction than that of the plate-shaped portion in the second direction; and a slit formed from the tip portion to the plate-shaped portion so as not to reach the support portion of the inspection terminal. The tip portion of the inspection terminal has a first contact portion and a second contact portion that are separated from each other by way of via the slit, and each contact portion is brought into contact with an external terminal of a semiconductor package, and an electrical test of the semiconductor package is performed.

A contact pin includes: a first plunger including a first contact portion provided at an upper end, and a hollow body portion provided below the first contact portion; a second plunger including: a second contact portion provided at a lower end; a first taper portion that is provided above the second contact portion and enlarges in diameter toward the second contact portion; a small diameter portion provided above the first taper portion; and a large diameter portion that is provided above the small diameter portion and is inserted into the body portion to abut on an inner wall surface of the body portion; and a spring for energizing the first and second contact portions to be separated from each other. The first taper portion is capable of abutting on a lower end of the body portion in a case where the first and second contact portions approach each other.

A probe card device and a dual-arm probe are provided. The dual-arm probe has a probe length, and includes a bifurcation end portion and a testing end portion. The dual-arm probe has two broad side surfaces respectively arranged on two opposite sides thereof. The dual-arm probe has a separation slot that is recessed from a bifurcation opening of the bifurcation end portion toward the testing end portion and that penetrates from one of the two broad side surfaces to the other one, so that two branch arms of the dual-arm probe are defined by the separation slot and are spaced apart from each other. The separation slot has a slot length being 50% to 90% of the probe length. In a cross section of the two branch arms, an area of any one of the two branch arms is 90% to 110% of that of the other one.

A contact probe may include a Ni pipe that may include a coiled spring structure, and the Ni pipe 11 may contain 0.5 to 10 wt % of phosphorus (P). The contact probe may have improved durability, by reducing shrinkage, after probing performed in a high temperature environment.

A cylindrical body is formed of a conductive member provided with a spiral spring portion. Further, the cylindrical body includes a Ni metal layer and a Ni—W alloy layer containing W, and an end portion of the Ni—W alloy layer protrudes to an outer side of the Ni metal layer.

A test probe module is provided. The test probe module includes a circuit substrate, an interposer and a probe assembly. The interposer is coupled to the circuit substrate, and includes a plurality of through holes. The probe assembly is coupled to the interposer. The probe assembly includes a plurality of probes. A first terminal of each of the probes passes through a corresponding through hole and is electrically connected to the circuit substrate. A second terminal of each of the probes is in contact with a test object. The interposer has the same material properties as the test object.