A probe card device is provided. The probe card device includes a circuit substrate, an interposer, an adapter board and a probe assembly. The interposer is coupled to the circuit substrate, and the adapter board is coupled to the interposer. The probe assembly is coupled to the adapter board, and the probe assembly is electrically connected to the circuit substrate through the interposer and the adapter board. One terminal of each of the probes is electrically connected to the circuit substrate. Another terminal of each of the probes is in contact with a test object. The interposer, the adapter board and the test object have the same material properties.

The method may be used for measuring an electric property of a magnetic tunnel junction used in an embedded MRAM memory for example. The method uses a multi point probe with a plurality of probe tips for contacting a designated area of the test sample, which is electrically insulated from the part of the test sample which is to be tested. Electrically connections are placed underneath the magnetic tunnel junction and goes to the designated area.

A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

An electrical connecting device includes an insulating probe (10) including a bottom-side plunger (11), a top-side plunger (12), and a barrel (13), and a probe head (30) including a combined guide plate (30A) having a conductive region (301) made of a conductive material and an insulating region (302) made of an insulating material arranged adjacent to each other in a planar view. The bottom-side plunger (11) and the top-side plunger (12) are electrically connected to each other inside the barrel (13), and the bottom-side plunger (11) and the top-side plunger (12) are electrically insulated from the barrel (13). The probe head (30) holds the insulating probe (10) in a state in which the barrel (13) penetrates through the conductive region (301). The barrel (13) of the insulating probe (10) is connected to a ground potential via the conductive region (301) when an inspection object (4) is measured.

A semiconductor probe includes multiple metal layers. An oxide layer is disposed between each adjacent pair of the metal layer. A via for connecting at least one pair of the metal layers. At least one protection layer 150 is disposed at an external side of the metal layer.

A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Proposed is a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle has a predetermined depth d and has a length l that is greater than a width w, the conductive particle having a body part in a pillar shape, a first convex part having an upper surface, formed in a top of the body part, and a second convex part having a lower surface, formed in a bottom of the body part.

A probe head includes a linear probe which is flattened at least one of tail, body and head portions thereof and thereby defined with first and second width axes, along which each of the tail, body and head portions is defined with first and second widths, and upper and lower die units having upper and lower installation holes respectively, wherein the tail and head portions are inserted respectively, which are offset from each other along the second width axis so that the body portion is curved. The first and second widths of the body portion are respectively larger and smaller than the first and second widths of at least one of the tail and head portions. As a result, the probes of the same probe head are consistent in bending direction and moving behavior and prevented from rotation, drop and escape.

The purpose of the present disclosure is to provide a conductor part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the conductor part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package.

A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.