A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Provided is a connector plug includes: an optical device module having an optical engine that generates an optical signal or receives an optical signal; an optical fiber alignment guide member having an optical fiber insertion channel formed on one surface of the optical device module so that optical fibers are seated; and an optical component that is seated in an optical component alignment guide groove formed adjacent to the optical fiber alignment guide member on one surface of the optical device module, wherein the optical engine includes an optical device which is formed adjacent to the optical component on one surface of the optical device module, and which radiates an optical signal or receives an optical signal in the horizontal direction, and an optical integrated circuit (IC) installed in the optical device module and controlling the optical device.

A structure and method for the formation of a reflector structure having three-dimensional surface curvature is disclosed. Beam narrowing upon reflection from the three-dimensionally curved surface in embodiments can provide improved coupling efficiency in addition to the directional change provided by the reflector.

An optical subassembly comprising: (a) an interposer having first and second opposing sides and defining an alignment aperture extending from said first opposing side to said second opposing side, said interposer defining traces having contacts; (b) a fiber having a first optical axis, said fiber being held such that first optical axis is positioned essentially orthogonal to said first and second opposing sides; (c) at least one optical component mounted to said second opposing side and being electrically connected to at least a portion of said contacts, said at least one optical component having a second optical axis coincident with said first optical axis; and (d) a circuit board configured to receive said interposer such that said interposer is essentially orthogonal to said circuit board and said first optical axis is essentially parallel to said circuit board, said circuit board being electrically connected to at least a portion of said contacts.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

Disclosed embodiments relate to additive manufacturing systems. In some embodiments, an additive manufacturing system may include a plurality of laser energy sources, an optics assembly configured to direct laser energy onto a build surface, and an optical fiber connector positioned between the plurality of laser energy sources and the optics assembly. A first plurality of optical fibers may extend between the plurality of laser energy sources and the optical fiber connector, and a second plurality of optical fibers may extend between the optical fiber connector and the optics assembly. Each optical fiber of the first plurality of optical fibers may be coupled to a corresponding optical fiber of the second plurality of optical fibers within the optical fiber connector.

A semiconductor module includes a photonic integrated circuit and a receptacle. The photonic integrated circuit includes a substrate, a waveguide disposed on the substrate, and a recess in the substrate and having a first width. The receptacle is bonded to a top surface of the substrate and aligning with the recess. The receptacle and the recess jointly form a cavity, and the receptacle has a second width greater than the first width. A method for manufacturing the semiconductor module is also disclosed.

An electro-optical module is provided in the form of a Ceramic Ball Grid Array (CBGA) optical package with a detachable fiber optic connector. The electro-optical module is capable of being surface mounted on printed circuit boards using standard 5 electronics pick-and-place and reflow manufacturing technology. This package allows ultra-high-speed single mode fiber based optical transmit and receive devices to be mounted directly on Printed Circuit Boards (PCBs) in close proximity to their associated electronics. The resulting shorter electrical interconnects reduce losses and distortion of the high frequency electrical signals enabling lower power signals and lower error rates 10 on the interfaces, for applications such as high-speed data center interconnects. Shorter electrical interconnects may also allow for simpler clock and data recovery circuits or, in some cases, complete elimination of some of these circuits.

Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.