An optical connector includes a lens body having a lens portion, a fiber optic transceiver having an optical element, a housing, an biasing portion configured to bias the fiber optic transceiver toward the lens portion, and a plurality of abutment convex portions provided on at least one of the lens body and the fiber optic transceiver such that the fiber optic transceiver biased toward the lens body by the biasing portion is arranged in parallel to the lens body with a uniform gap between the fiber optic transceiver and the lens body in a direction along an optical axis of the optical element.

Photonic integrated circuits (PICs) enable manipulation of light on a chip for telecommunications and information processing. They can be made with silicon and silicon-compatible materials using complementary metal-oxide-semiconductor (CMOS) fabrication techniques developed for making electronics. Unfortunately, most light sources are made with III-V and II-VI materials, which are not compatible with silicon CMOS fabrication techniques. As a result, the light source for a PIC is either off-chip or integrated onto the PIC after CMOS fabrication is over. Hybrid integration can be improved by forming a recess in the PIC to receive a III-V or II-VI photonic chip. Mechanical stops formed in or next to the recess during fabrication align the photonic chip vertically to the PIC. Fiducials on the PIC and the photonic chip enable sub-micron lateral alignment. As a result, the photonic chip can be flip-chip bonded to the PIC with sub-micron vertical and lateral alignment precision.

A system includes a first free-air optical interconnect of a first electrical component, the first free-air optical interconnect configured to mechanically couple to a second free-air optical interconnect of a second electrical component to communicate optical signals between the first and second electrical components. When coupled, an attach mechanism of the first free-air optical interconnect can retain the second free-air optical interconnect a fixed distance from the communication interface of the first free-air communication interface, including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of a laser emitter configured to transmit laser energy across an air gap to a separate device, or a photodiode configured to detect laser energy received across the air gap from the separate device.

A mounting structure for an optical module includes a light emitting element, a submount board on which the light emitting element is mounted, a main board on which the submount board is mounted, a light guide member provided on the main board, and a diffraction grating optical coupler provided on the main board and connected to the light guide member. The submount board and the main board are bonded to each other on a surface of the submount board different from a surface on which the light emitting element is mounted.

An optical connector device includes: a first optical connector that has a first housing that holds a ferrule; and a second optical connector that has a second housing that houses an FOT and a light guide member. The second housing includes a ferrule insertion portion. The ferrule insertion portion has a ferrule insertion hole into which the ferrule can be inserted. An inner peripheral surface of the ferrule insertion hole has a ferrule fixing structure that fixes the ferrule inside the ferrule insertion hole to suppress play of the ferrule inside the ferrule insertion hole.

The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.

The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.

Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. A grating waveguide combiner comprising a plurality of waveguides having grating couplers thereon may be used to combine beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. Such optical engines may have advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.

There are disclosed herein various implementations of a silicon-on-insulator (SOI) die including a light emitting layer pedestal-aligned with a light receiving segment, as well as methods for fabricating such an SOI die. The SOT die includes a pedestal region of the SOI die having a pedestal including a thin top silicon segment, a buried oxide (BOX) segment, and a handle wafer segment. The SOI die also includes an integrated circuit (IC) region having a thin silicon waveguide that is aligned with the thin top silicon segment in the pedestal region. A light emitting layer is situated over the pedestal in the pedestal region, the light emitting layer being aligned with the light receiving segment to situated over the thin silicon waveguide in the IC region.

An optical device includes a light-emitting element; an electronic circuit chip; a substrate on which the light-emitting element and the electronic circuit chip are mounted; a first electrode formed on a first mounting surface of the light-emitting element on the substrate; and a second electrode formed on a second mounting surface of the electronic circuit chip on the substrate.

The first electrode and the second electrode have the same structure.