The Non-Volatile Arithmetic Memory Operator (NV-AMO) including a non-volatile memory cell for storing non-volatile data and a first input terminal for receiving volatile variable data is applied to perform the arithmetic operations over the volatile variable data and the non-volatile data. The NV-AMO can also be configured multiple-times for new computations. The constructions of NV-AMO in Arithmetic Logic Units (ALU) can be applied in DSP (Digital Signal Processor) computations and DNN (Deep Neural Network) computations.

The present disclosure includes apparatuses, methods, and systems for preventing parasitic current during program operations in memory. An embodiment includes a sense line, an access line, and a memory cell. The memory cell includes a first transistor having a floating gate and a control gate, wherein the control gate of the first transistor is coupled to the access line, and a second transistor having a control gate, wherein the control gate of the second transistor is coupled to the access line, a first node of the second transistor is coupled to the sense line, and a second node of the second transistor is coupled to the floating gate of the first transistor. The memory cell also includes a diode, or other rectifying element, coupled to the sense line and a node of the first transistor.

Methods, systems, and devices for sequential voltage control for a memory device are described. A memory device may have various voltage sources that support different voltage levels used in various operations of the memory device. Voltage sources of a memory device may be disabled under some circumstances, such as when the memory device is idled, or operated in a low-power or powered-down mode, among other circumstances. In accordance with examples as disclosed herein, voltage sources of a memory device or memory die may be sequentially enabled or sequentially disabled. For example, voltage sources may be enabled in an order from voltage sources having relatively higher nominal voltages to voltage sources having relatively lower voltages, or disabled in an order from voltage sources having relatively lower nominal voltages to voltage sources having relatively higher voltages.

A non-volatile memory cell includes a first well of a first conductivity type and a second well of a second conductivity type in a body adjacent to each other; a first conduction region, a second conduction region and a third conduction region in the first well, the first, second and third conduction regions being of the second conductivity type; a control gate region, of the first or second conductivity type, in the second well; a selection gate over the first well forming, together with the first and second conduction regions, a selection transistor; and a floating gate region. The floating gate region has a programming portion overlying the first well and a capacitive portion overlying the second well. The floating gate region forms, together with the second and third conduction regions, a storage transistor and, together with the control gate region, a capacitive element.

A multi-time programming non-volatile memory includes a select transistor, a floating gate transistor, a switch transistor, a capacitor and an erase gate element. The select transistor is connected with a select line and a source line. The floating gate transistor includes a floating gate. The floating gate transistor is connected with the select transistor. The switch transistor is connected with a word line, the floating gate transistor and a bit line. A first terminal of the capacitor is connected with the floating gate. A second terminal of the capacitor is connected with a control line. The erase gate element includes the floating gate, a gate oxide layer and a p-type region. The erase gate element is connected with an erase line. The floating gate of the erase gate element at least includes an n-type floating gate part.

Memories might include an array of memory cells including a string of series-connected split-gate memory cells, and a controller configured to cause the memory to selectively activate a first memory cell portion of a selected split-gate memory cell of the string of series-connected split-gate memory cells in response to a data state of the first memory cell portion of the selected split-gate memory cell and deactivate a second memory cell portion of the selected split-gate memory cell, and activate a second memory cell portion of each remaining split-gate memory cell of the string of series-connected split-gate memory cells while selectively activating the first memory cell portion of the selected split-gate memory cell and deactivating the second memory cell portion of the selected split-gate memory cell.

An erasable programmable single-poly non-volatile memory cell and an associated array structure are provided. The memory cell comprises a select transistor and a floating gate transistor. The floating gate of the floating gate transistor and an assist gate region are collaboratively formed as a capacitor. The floating gate of the floating gate transistor and an erase gate region are collaboratively formed as another capacitor. Moreover, the select transistor, the floating gate transistor and the two capacitors are collaboratively formed as a four-terminal memory cell. Consequently, the size of the memory cell is small, and the memory cell is operated more easily.

Methods, systems, and devices for sequential voltage control for a memory device are described. A memory device may have various voltage sources that support different voltage levels used in various operations of the memory device. Voltage sources of a memory device may be disabled under some circumstances, such as when the memory device is idled, or operated in a low-power or powered-down mode, among other circumstances. In accordance with examples as disclosed herein, voltage sources of a memory device or memory die may be sequentially enabled or sequentially disabled. For example, voltage sources may be enabled in an order from voltage sources having relatively higher nominal voltages to voltage sources having relatively lower voltages, or disabled in an order from voltage sources having relatively lower nominal voltages to voltage sources having relatively higher voltages.

An erasable programmable single-poly non-volatile memory cell and an associated array structure are provided. In the memory cell of the array structure, the assist gate region is composed at least two plate capacitors. Especially, the assist gate region at least contains a poly/poly plate capacitor and a metal/poly plate capacitor. The structures and the fabricating processes of the plate capacitors are simple. In addition, the uses of the plate capacitors can effectively reduce the size of the memory cell.

Memory might include an array of memory cells having a plurality of strings of series-connected split-gate memory cells each including a primary memory cell portion and an assist memory cell portion, a plurality of primary access lines each connected to a control gate of the primary memory cell portion of a respective split-gate memory cell of each string of series-connected split-gate memory cells of the plurality of strings of series-connected split-gate memory cells, and a plurality of assist access lines each connected to a control gate of the assist memory cell portion of its respective split-gate memory cell of each string of series-connected split-gate memory cells of the plurality of strings of series-connected split-gate memory cells.