Methods of operating a memory include receiving data for programming to a plurality of memory cells of the memory, redistributing the received data in a reversible manner, programming the redistributed data to the plurality of memory cells, and programming respective second data to each memory cell of the plurality of memory cells containing the redistributed data, wherein the respective second data for any memory cell of the plurality of memory cells has a same data value as the respective second data for each remaining memory cell of the plurality of memory cells.

Transpose non-volatile (NV) memory (NVM) bit cells and related data arrays configured for both memory row and column, transpose access operations. A plurality of transpose NVM bit cells can be arranged in memory rows and columns in a transpose NVM data array. To facilitate a row read operation, the transpose NVM bit cell includes a first access transistor coupled to a word line. An activation voltage is applied to the word line to activate the first access transistor to read a memory state stored in the NVM cell circuit in a row read operation. To facilitate a column, transpose read operation, the transpose NVM bit cell includes a second access transistor coupled to a transpose word line. An activation voltage is applied to the transpose word line to activate the second access transistor to read the memory state stored in the NVM cell circuit in a column, transpose read operation.

Semiconductor device, memory arrays, and methods of forming a memory cell include or utilize one or more memory cells. The memory cell(s) include a first nanosheet transistor located on top of a substrate and connected to a first terminal, a second nanosheet transistor located on top of the first nanosheet transistor and connected in parallel to the first nanosheet transistor and connected to a second terminal, where the first and second nanosheet transistors share a common floating gate and a common output terminal, and an access transistor connected in series to the common output terminal and a low voltage terminal, the access transistor configured to trigger hot-carrier injection to the common floating gate to change a voltage of the common floating gate.

A nonvolatile memory structure includes a first PMOS transistor and a first floating-gate transistor on a first active region in a substrate, a second PMOS transistor and a second floating-gate transistor on a second active region in the substrate, and an n-type erase region in the substrate. A source line connects with sources of the first and the second PMOS transistors. A bit line connects with drains of the first and the second floating-gate transistors. A word line connects with first and the second select gates in the first and the second PMOS transistors respectively. An erase line connects with the n-type erase region. The first floating-gate transistor includes a first floating gate with an extended portion extending on a first portion of the n-type erase region. The second floating-gate transistor includes a second floating gate with an extended portion extending on a second portion of the n-type erase region.

A memory array includes a plurality of memory pages, each memory page includes a plurality of memory cells, and each memory cell includes a floating gate module, a control element, and an erase element. The floating gate module is disposed in a first well, the erase element is disposed in a second well, and the control element is disposed in a third well. The first well, the second well and the third well are disposed in a deep doped region, and memory cells of the plurality of memory pages are all disposed in the deep doped region. Therefore, the spacing rule between deep doped regions is no longer be used to limit the circuit area of the memory array and the circuit area of the memory array can be reduced.

Memory devices include control logic configured to set a first start program voltage and a first stop program voltage, to load actual first data for cells to be programmed to a level greater than or equal to a first level, and to load inhibit data for cells to be programmed to a level less than a second level. After programming the cells to be programmed to the level greater than or equal to the first level, the control logic is further configured to set a second start program voltage and a second stop program voltage, to load inhibit data for the cells programmed to the level greater than or equal to the first level, and to load actual second data for the cells to be programmed to the level less than the second level, wherein the first level is one level higher than the second level.

Various embodiments, disclosed herein, can include apparatus and methods to perform a one check failure byte (CFBYTE) scheme in programming of a memory device. In programming memory cells in which each memory cell can store multiple bits, the multiple bits being a n-tuple of bits of a set of n-tuples of bits with each n-tuple of the set associated with a level of a set of levels of threshold voltages for the memory cells. Verification of a program algorithm can be structured based on a programming algorithm that proceeds in a progressive manner by placing a threshold voltage of one level/distribution at a time. The routine of this progression can be used to perform just one failure byte check for that specific target distribution only, thus eliminating the need to check failure byte for all subsequent target distribution during every stage of program algorithm. Additional apparatus, systems, and methods are disclosed.

A three-dimensional block includes a stack comprising a plurality of control gate layers configured to bias memory cells of the block. The block includes a plurality of track regions that includes three or more hookup regions. The plurality of track regions separate the memory cells into three memory cell regions. Tracks extending in the track regions supply voltages to the hookup regions. A system includes a memory plane of blocks, and a plurality of track regions, each extending across the memory plane of blocks.

Methods of operating a memory include determining a voltage level of a plurality of voltage levels at which a memory cell is deemed to first activate in response to applying the to a control gate of that memory cell for each memory cell of a plurality of memory cells, determining a plurality of voltage level distributions from numbers of memory cells of a first subset of memory cells deemed to first activate at each voltage level of the plurality of voltage levels, determining a transition between a pair of voltage level distributions for each adjacent pair of voltage level distributions, and assigning a respective data state to each memory cell of a second subset of memory cells responsive to the determined voltage level at which that memory cell is deemed to first activate and respective voltage levels of the transitions for each adjacent pair of voltage level distributions.

Methods of operating a voltage generation circuit include applying a clock signal to an input of a voltage driver of a stage of the voltage generation circuit, connecting the output of the voltage driver to a first voltage node configured to receive a first voltage when the clock signal has a particular logic level and a voltage level of an output of the voltage driver is less than a threshold, connecting the output of the voltage driver to a second voltage node configured to receive a second voltage, greater than the first voltage, when the clock signal has the particular logic level and the voltage level of the output of the voltage driver is greater than the threshold, and connecting the output of the voltage driver to a third voltage node configured to receive a third voltage, less than the first voltage, when the clock signal has a different logic level.