A probe pin is proposed. The probe pin includes a first plunger configured to come in contact with a testing target contact point of a testing object and a second plunger configured to come in contact with a testing contact point of a testing circuit, in which the first plunge or the second plunger has a stem extending with a predetermined cross-sectional area and a contact portion extending from the stem such that a cross-sectional area decreases, and having first second tips, which are configured to come in contact with the testing target contact point or the testing contact point, at a front end; and the first and second tips are formed in symmetric shapes at positions that are symmetric with a central axis of the stem therebetween.

A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.

The testing apparatus for singulated semiconductor dies comprises a nesting frame and a bottom part, which form a testing device nest adapted to the size of a semiconductor die. A pushing device is provided for an alignment of the semiconductor die in the testing device nest. An engineering plastic layer on the bottom part forms a surface on which the semiconductor die slides during its alignment.

A test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member configured to support the probe between an inner wall of the pipe and an outer surface of the probe. The test probe assembly of the present disclosure is improved in noise shield performance and convenient in repairing the probe since the probe is mounted to a probe socket as supported in a metal pipe without contacts.

A probe unit includes: a plurality of first contact probes each coming into contact with an electrode to be contacted on one end side in a longitudinal direction; a second contact probe connected to an external ground; and a probe holder configured to hold the first and second contact probes, the probe holder including a first hollow portion configured to allow the first contact probes to be inserted therethrough and hold the first contact probes, a second hollow portion configured to allow the second contact probe to be inserted therethrough and hold the second contact probe, and a through-hole provided around the first hollow portion, wherein the probe holder includes a conductive portion that constitutes the through-hole and electrically connects the through-hole and the second contact probe.

Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

A plurality of batteries is stacked, together with spacers, in a compressed state. Charging and discharging units are arranged facing lead terminals protruding from the batteries and are independently operable for the respective batteries. The charging and discharging units each independently include substantially V-like shaped power-side and measurement-side contact elements elastically supported by compression coil springs and having floating freedom. When the batteries are moved all together toward the charging and discharging units, front end surfaces of the lead terminals are pressed against and electrically connected to flat surfaces of the power-side and measurement-side contact elements. By this, it is possible to smoothly perform charging and discharging inspection on the batteries even when the lead terminals protruding from the battery package are subjected in advance to surface treatment.

A capacitive test apparatus for testing an electronic device contained within a package, the apparatus comprising: a plurality of conductive pads in electrical communication with the processor, wherein the plurality of conductive pads are configured to align with electrodes of the electronic device during testing and capacitively couple electrical stimuli to the electrodes via the package; processing circuitry configured to: apply the electrical stimuli to the plurality of conductive pads; receive one or more response signals induced by the electrical stimuli coupled through the package; and determine one or more electrical characteristics of the electronic device based on the one or more response signals.

A probe testing device having an elastic structure is provided. The probe testing device having the elastic structure includes a plurality of probe elements and a guide plate module. Each of the probe elements includes a body, a first contact segment, and a second segment, and is formed integrally. The guide plate module includes a first guide plate, a second guide plate, and a third guide plate that are parallel to each other, and the third guide plate is arranged between the first guide plate and the second guide plate. The plurality of probe elements correspondingly pass through the first guide plate, the second guide plate, and the third guide plate. The third guide plate is configured to perform a parallel movement relative to the first guide plate and the second guide plate in a direction perpendicular to an axis of the probe element.

A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring. A method includes disposing a first plunger within a spring along a spring longitudinal axis, disposing a second probe within the spring along the spring longitudinal axis, and engaging the spring latch and the second plunger spring latch with the spring, for instance by capturing an end coil of the spring with the spring latch of at least one of the spring latch or the second plunger spring latch.