A probe pin according to an embodiment of the present invention has a two-piece structure consisting of a pogo pin part and a barrel part, in which the pogo pin part includes an upper plunger having an outside contact point at an upper end, a lower plunger having an outside contact point at a lower end, and a spring portion composed of one or more springs and connected to a lower end of the upper plunger and an upper end of the lower plunger; and the barrel part has a cylindrical shape surrounding a portion of the pogo pin part and has a barrel-fixing spring portion protruding on an outer side of the barrel part to apply elasticity outward.

An electrical Kelvin contact assembly for testing IC testing apparatus that uses an assembly design that reduces the tolerance to a near negligible range. The assembly does not use any screws, dowel pins, adhesives or welding to fasten the electrical contacts to the housing. The design of the assembly uses rows of contacts with specially designed protrusions that sit snugly in openings located on three plate-like layers. These layers contain the contacts in the horizontal plane by securing the protrusions in the opening, as well as in the vertical plane by means of a sandwich between three separate layers. A second contact is slid into back slits formed by the three layers.

A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.

A testing device includes a base body, a holder, an electrically conductive plate, plural testing probes and plural insulation structures. The testing device of the present invention uses the electrically conductive plate to replace the plastic plate of the conventional testing device. Consequently, the electrostatic discharge effect is avoided. Moreover, the insulation structure is arranged between the testing probe and the electrically conductive plate to separate the testing probe from the electrically conductive plate so as to avoid the electric leakage problem. Consequently, the testing device of the present invention is capable of avoiding the electrostatic discharge effect without causing damage of the under-test object and reducing the measurement accuracy.

An electric connection device includes a probe (10) and a probe head (20). The probe (10) includes: a tubular barrel (11), a rod-like top-side plunger (121), and a rod-like bottom-side plunger (122). The top- and bottom-side plungers are connected to the barrel (11) with tips thereof exposed from respective open ends of the barrel (11). The probe head (2) includes guide plates (211 and 212) which are spaced apart from each other in the axial direction of the probe (10) and each include a through-hole through which a body of the barrel (11) penetrates. A protrusion (13) having an outer diameter greater than the body of the barrel (11) is provided on the circumference of the probe (10). The guide plates (211 and 212) include a support guide plate in which the through-hole has a diameter smaller than the outer diameter of the protrusion (13). The probe (10) is supported by the support guide plate with the top-side plunger (121) up such that the lower section of the protrusion (13) is in contact with the edge of the upper opening of the through-hole of the support guide plate.

High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.

An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.

A probe includes: a rod-shaped plunger (11) including a tip section (111) and an insertion section (112) connected to the tip section (111); a tube-shaped barrel (12) in which the insertion section (112) of the plunger (11) is located inside; and a conductive first fixing member (131) which is located in an area where the plunger (11) and the barrel (12) face each other and is configured to fix the plunger (11) to the barrel (12), the first fixing member (131) having a lower melting point than that of the material of both of the plunger (11) and the barrel (12). The gap between the plunger (11) and the barrel (12) is filled with the first fixing member (131) without any voids in a cross section of the probe in an area where the plunger (11) and the barrel (12) overlap each other, including the area where the first fixing member (131) is located.

A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.