A method and apparatus permit the testing of electrochemical cells. The apparatus includes a heat source, a chamber, and a diffuser coupling the heat source to the chamber. The heat source applies heat via the diffuser to a pin-point section of the electrochemical cell. This application of heat causes a thermal runaway condition due to a localized internal short circuit in the electrochemical cell. It is then determined whether the electrochemical cell has vented, ruptured, or exploded in response to the application of the heat source to the thermal runaway pin-point section of the electrochemical cell.

An inspection device according to an embodiment can conduct high temperature inspection and low temperature inspection on an object to be inspected. The inspection device includes an inspection chamber in which inspection is conducted on the object; a dry air supply section that is connected to the inspection chamber via a first valve and that is configured to supply dry air into the inspection chamber; a dew point meter that is connected to the inspection chamber via a second valve and that is configured to measure a dew point in the inspection chamber; and a bypass pipe connecting the dry air supply section and the dew point meter via a third valve.

A thermal measurement system includes a temperature-controlled chamber configured to house a Device Under Test (DUT) and a first temperature sensor to measure an external temperature of the DUT inside the temperature-controlled chamber. The thermal measurement system further includes a heating device for heating a test material outside the temperature-controlled chamber and a controller configured to control the heating device to heat the test material to the external temperature measured by the first temperature sensor of the DUT inside the temperature-controlled chamber. In one aspect, a thermethesiometer indicates a skin effect of a surface temperature of the test material outside the temperature-controlled chamber.

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

A probe card includes a sub-board, having a heating layer, connected to a probe pin. A main board is connected to the sub-board and includes a first output terminal configured to output first power received from a first power supply to the heating layer in a first mode. A power converter is configured to lower a first voltage corresponding to residual power received from the first power supply to a second voltage and output the residual power in a second mode. A second output terminal is configured to receive the residual power from the power converter and second power from a second power supply and output third power including the residual power and the second power to a device under test in the second mode. A first switch unit is connected to the first power supply, the first output terminal, and the power converter.

A heater substrate has an insulating substrate having a first surface and a second surface on the opposite side relative to the first surface and at least one heating element of spiral shape including plural heater wire pieces and positioned in or on the insulating substrate. The heating element of spiral shape has at least one adjustment section including a turn of all or some of the plural heater wire pieces. The plural heater wire pieces include a first heater wire piece and a second heater wire piece adjacent to the inner side of the first heater wire piece. In the adjustment section, the length of the first heater wire piece is smaller than the length of the second heater wire piece.

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

A support device includes a support that supports an object to be tested and that includes a flow path inside, the flow path having an inlet and an outlet, and the flow path being configured to flow a first temperature adjusting medium from the inlet to the outlet, a mixer configured to discharge a third temperature adjusting medium, the first temperature adjusting medium flowing out from the outlet and a second temperature adjusting medium externally supplied being mixed at a ratio that is predetermined in the third temperature adjusting medium, a medium transfer configured to transfer the third temperature adjusting medium to the inlet as the first temperature adjusting medium, and a heater configured to heat the first temperature adjusting medium or the third temperature adjusting medium.

A testing apparatus for Devices Under Test (DUTs) includes at least one intake damper and at least one exhaust damper. At least one fan moves recirculated fluid and exterior fluid across one or more DUTs inside the testing apparatus. In one aspect, the testing apparatus includes a door to provide access to a chamber and the door includes at least one channel. At least a portion of the fluid flows through the at least one channel of the door. In another aspect, the door is configured to provide access to a chamber from the front of the chamber and the fluid is moved in a direction across the one or more DUTs substantially from the front of the chamber towards a rear of the chamber.

An inspection system including a first chiller unit configured to supply a first heating medium controlled to a first temperature, a second chiller unit configured to supply a second heating medium controlled to a second temperature lower than the first temperature, a stage having a flow passage supplied with a heating medium mixed with the first heating medium and the second heating medium at a desired mixing ratio, and a controller, wherein the inspection system performs an inspection with respect to a substrate placed on the stage, and the controller controls a process of measuring a temperature of the heating medium at an inlet of the flow passage and a temperature of the heating medium at an outlet of the flow passage, and a process of correcting the mixing ratio of the first heating medium and the second heating medium, based on a difference between the temperatures of the heating medium at the inlet and outlet, and a flow rate of the heating medium, is provided.