A memory device may be provided. The memory device may include a test data output circuit configured to compare lower data output from a lower data storage region with upper data output from an upper data storage region and make a decision. The memory device may include a data transmitter configured to output the lower data by inverting or noninverting the lower data according to the decision. The memory device may include a test control circuit generates a test control signal according to a test read signal and an address signal.

Disclosed herein is a test circuit for testing a device under test (DUT). The test circuit receives a test pattern output by the DUT. A content addressable memory (CAM) stores expected test data at a plurality of address locations, receives the test pattern, and outputs an address of the CAM containing expected test data matching the received test pattern. A memory also stores the expected test data at address locations corresponding to the address locations of the CAM. A control circuit causes the memory to output the expected test data stored therein at the address output by the CAM. Comparison circuitry receives the test pattern from the input, and compares that received test pattern to the expected test data output by the control circuit, and generates an error count as a function of a number of bit mismatches between the received test pattern and the expected test data.

Aspects of present disclosure relate to an integrated circuit chip (chip), a method and a computer program product of testing the chip. The method of testing the chip may include: partitioning the chip into various partitions, loading built-in self-test (BIST) test instructions into BIST engine and initializing a current partition counter, performing BIST test on current partition, transmitting test results of the current partition of the chip to an external test data storage, checking whether current partition is the last partition, incrementing current partition counter, and returning to performing BIST on a next partition when current partition is not the last partition, and exiting BIST test when current partition is the last partition. The test results may be stored in one or more inactive storage elements of the chip. The number of partitions may include: one partition, a predetermined number of partitions, and a variable number of partitions.

The present invention provides a measuring device (1, 11) for measuring signals (2, 12), the measuring device (1, 11) comprising a data memory (4, 14) configured to store device data (5, 15) for the measuring device (1, 11), and a data interface (6, 16) connected to the data memory (4, 14) and configured to read the device data (5, 15) from the data memory (4, 14) and output at least a part of the read device data (5, 15) to an external memory device (7, 17) in a storage mode and to read device data (5, 15) from the external memory device (7, 17) and store the read device data (5, 15) in the data memory (4, 14) in a recovery mode. The present invention further provides a corresponding method for such a measuring device (1, 11).

An integrated circuit includes a Built-In Self-Test (BIST) circuit, a predetermined signature pattern and a Read Only Memory (ROM), wherein the predetermined signature pattern is stored in the integrated circuit. The ROM stores at least effective information and a BIST signature adjustment code, the BIST signature adjustment code is irrelevant to any functional information stored in the ROM; wherein the BIST circuit is used to test content stored in the ROM to generate a signature pattern, and compare the signature pattern with the predetermined signature pattern to judge if the content stored in the ROM has error.

A determination device includes an estimation circuit and a determination circuit. The estimation circuit generates estimation data by estimating input data in the n-th cycle based on the input data in cycles prior to the n-th cycle and a first generator polynomial. The determination circuit determines whether the input data and the estimation data match. The first generator polynomial is an arithmetic expression that sets the estimation data in the n-th cycle to an inverted value of the input data in (n1)-th cycle if a logical sum of all the input data in a first period corresponding to a preset number of cycles prior to the n-th cycle is 0 or a logical product of all the input data in a second period corresponding to the preset number of cycles prior to the n-th cycle is 1, and sets the estimation data in the n-th cycle to the same value as the input data in the (n1)-th cycle if the logical sum is not 0 and the logical product is not 1.

A semiconductor test apparatus is provided. The semiconductor test apparatus includes: a test management unit determining a test mode, generating a test signal in accordance with the determined test mode, and transmitting the test signal to fail memories; and one or more fail memory boards including the fail memory, which store fail signals generated as a result of a test conducted in accordance with the test signal and address information of the fail signals, wherein if the determined test mode is a first test mode, at least some of the failure memory boards are powered off.

A semiconductor test apparatus comprises a failure memory (FM) block configured to store failure data generated from a result of testing a semiconductor device, a buffer memory (BM) block to/in which the failure data stored in the FM block is configured to be copied/stored, and a field programmable gate array (FPGA) configured to perform a first control operation to control the FM block and a second control operation to control the BM block.

A semiconductor device according to the present disclosure includes a central processing unit (CPU), an external terminal receiving a signal from outside, a memory storing an external input signal supplied via the external terminal, an input signal necessary for a processing the CPU, and a switching circuit that switches to the external input signal stored in the memory from the external input signal obtained via the external terminal.

The present specification discloses a test device, a test system, a test method, and a test apparatus. The test device provided in the present specification includes an FPGA chip capable of controlling a target power supply that supplies power to an MCU under test. In practice, different test logic programs can be configured in the FPGA chip based on actual needs, to satisfy a need of flexibly testing different types of MCUs under test. In addition, the FPGA chip in the test device can be used to generate a high-frequency clock signal, to ensure time accuracy when voltage glitch faults are injected into the MCU under test, so as to further ensure a test effect for the MCU under test.