An active shielding device and method for active shielding are disclosed. The active shielding device includes current sources configured to generate currents, an analog wire shield unit connected to the current sources, a current to voltage converter connected to the analog wire shield unit and configured to generate a voltage in response to the currents that are generated by the current sources, and a voltage comparator connected to the current to voltage converter and configured to compare the voltage that is generated by the current to voltage converters with a reference voltage.

Systems and methods for providing fraud prevention inserts in a chip pocket of a card are provided. A chip fraud prevention system includes a device including a chip and one or more fraud prevention inserts. The chip, and the fraud prevention inserts, may be at least partially encompassed in a chip pocket.

A semiconductor substrate has a front face and a back face. A first contact and a second contact, spaced apart from each other, are located on the front face. An electrically conductive wafer is located on the back face. A detection circuit is configured to detect a thinning of the substrate from the back face. The detection circuit including a measurement circuit that takes a measurement of a resistive value of the substrate between said at least one first contact, said at least one second contact and said electrically conductive wafer. Thinning is detected in response to the measured resistive value.

Example embodiments of systems and methods for preventing chip fraud are provided. A chip fraud prevention system may comprise a device including a chip, wherein the chip is at least partially encompassed in a chip pocket. One or more connections may be communicatively coupled to one or more surfaces of the chip, and a capacitance member may be coupled to a surface of the chip. The capacitance member may comprise a known capacitance value and the chip may comprise a memory containing an applet, wherein the applet is configured to measure the capacitance value of the capacitance member.

Methods, systems, and computer program products for creating a monitoring network are described. A server associates a master wireless node with a package in a first set of associated packages. The server and the master wireless node communicate with one another over first type of wireless communications interface. The server also associates a peripheral wireless node with another package in the set and with the master node. The peripheral wireless node and the master wireless node communicate with one another over a second type of wireless communications interface. The peripheral node includes a sensor operative to generate sensor data by sensing an environmental condition. The master wireless node processes the sensor data to generate one or more package-level statistics of the processed sensor data.

A system for determining a load status of an asset container, comprising: a first tape node having a first low-power wireless-communications interface and a first camera, the first tape node operable to capture and transmit a first image; and a second tape node, comprising: a second camera; a second low-power wireless-communication interface; a processor; and memory communicatively coupled with the processor and storing machine-readable instructions that, when executed by the processor, cause the processor to: receive, from the first tape node, the first image; capture a second image using the second camera; perform computer vision techniques on the first and second images to generate the load status of the asset container; and transmit the load status to a nearby node.

A semiconductor substrate of an integrated circuit is protected by a coating. The semiconductor includes a front face and a rear face. To detect a breach of the integrity of a semiconductor substrate of an integrated circuit from the rear face, an opening of the coating facing the rear face of the substrate is detected. In response thereto, an alarm is generated. The detection is performed by making resistance measurements with respect to the semiconductor substrate and comparing the measured resistance to a nominal resistive value of the semiconductor substrate.

The disclosure provides systems and methods for tracking a smart container. The methods use sensors of the smart container to detect tampering with the smart container after the container leaves a sender and before the container arrives at a receiver. In particular, the sensors detect when the smart container has been opened by someone other than the receiver (i.e., tampered with) and write the detection of tampering (e.g., the sensor measurement) to a blockchain. Delivery agents use scanners to write their possession or agency over the smart container to the blockchain. Accordingly, the agency of the smart container can be determined if tampering occurs.

Provided herein is a method, apparatus, and system for detecting conditions indicative of an attempt to attach a skimming device to a payment device. Methods may include monitoring at least one wire among a plurality of wires between a card reader device and a motherboard; determining voltage consumption; determining current consumption; identifying a change in voltage consumption or current consumption satisfying a predetermined value; and providing for transmission of an alert of a condition indicating possible attachment of a card skimming device. Methods may include generating a status message periodically and transmitting the status message to a remote entity. The change in voltage consumption or current consumption satisfying the predetermined value may include a voltage instability exceeding a predetermined range about an anticipated voltage. The change in voltage consumption or current consumption satisfying the predetermined value may include a decrease in current satisfying the predetermined value.

Methods, systems, and computer program products for creating a monitoring network are described. A server associates a master wireless node with a package in a first set of associated packages. The server and the master wireless node communicate with one another over first type of wireless communications interface. The server also associates a peripheral wireless node with another package in the set and with the master node. The peripheral wireless node and the master wireless node communicate with one another over a second type of wireless communications interface. The peripheral node includes a sensor operative to generate sensor data by sensing an environmental condition. The master wireless node processes the sensor data to generate one or more package-level statistics of the processed sensor data.