A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.

This inspection jig is provided with: an inspection-side support member having a counter plate (51) provided with a facing surface (F) disposed to face the substrate; and an electrode-side support member (6) having supporting plates (61-63) disposed to face an electrode plate (9) located on the side opposite to the facing surface (F) of the counter plate (51) A probe supporting hole (23), into and by which the rear end portion of the probe (Pr) is inserted and supported, is provided in the supporting plates (61-63), and the probe supporting hole (23) is provided with a restricting surface which is formed along a supporting line (V) inclined at a certain angle () with respect to a reference line (Z), and which restricts the rear end portion of the probe (Pr) from moving in the direction perpendicular to the inclined direction of the supporting line (V).

A manufacturing method of contact probes for a testing head comprises the steps of: providing a substrate made of a conductive material; and defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

A rectangular probe of a probe card device includes a metallic pin and a metallic reinforcing body. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment extending from the first connecting segment in a direction away from the middle segment, and a second contacting segment extending from the second connecting segment in a direction away from the middle segment. The metallic reinforcing body is integrally formed on the middle segment. The Young's modulus of the metallic reinforcing body is larger than that of the metallic pin. The electric conductivity of the metallic pin is larger than that of the metallic reinforcing body. An outside diameter jointly formed by the metallic reinforcing body and the middle segment is larger than an outside diameter of the second connecting segment.

A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes formed at positions corresponding to the first through-holes, and a silicon oxide layer formed on exposed surfaces of the first silicon substrate and the second silicon substrate.

A probe unit includes: a first contact probe configured to come in contact with a signal electrode; a second contact probe configured to come in contact with a ground electrode; a probe holder including a first holder hole through which the first contact probe passes, and a second holder hole through which the second contact probe passes; and a conductive floating member including a first through hole to which the first contact probe is inserted and the signal electrode is inserted, and a second through hole to which the second contact probe is inserted and the ground electrode is inserted. The probe holder is configured such that at least an inner circumferential surface of the first holder hole has an insulating property, and the probe unit has a coaxial structure in which central axes of the first contact probe and the first through hole are aligned with each other.

A probe is inserted into a through-hole in a guide plate and used for inspecting electrical characteristics of an inspection object, and the probe includes: a columnar conductor; and a plurality of insulating coating materials arranged spaced apart from each other on a surface of the conductor along a central axis direction of the conductor.

A vertical probe card and a fence-like probe thereof are provided. The fence-like probe has a probe length within a range from 5 mm to 8 mm. The fence-like probe includes a fence-like segment, a ceramic layer, a connection segment, and a testing segment. The fence-like segment has an elongated shape defining a longitudinal direction, and the fence-like segment has a penetrating slot that is formed along the longitudinal direction and that has a length greater than 65% of the probe length. The ceramic layer is directly formed on an outer surface of the fence-like segment and covers two long walls of the penetrating slot. The connection segment and the testing segment are respectively connected to two end portions of the fence-like segment, and is not formed on the connection segment and the testing segment.

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure.