The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.

An endoscope includes an optical module, the optical module including an optical element including a light emitting surface, an external electrode being disposed, out of a first region and a second region obtained by dividing the light emitting surface substantially in half, only in the first region, a wiring board including a first main surface where the optical element and a bonding electrode are disposed, a bonding wire connecting the external electrode and the bonding electrode to each other, a ferrule into which the optical fiber is inserted, a frame including an upper plate where the ferrule is disposed, including a side plate fixed to the first main surface, including an inner section housing the optical element and a side surface including an opening, and a transparent resin disposed in the inner section, wherein the upper plate is inclined at a predetermined inclination angle to the first main surface.

A line illuminating device includes: a light emitting unit that emits light; a light guide rod that is formed into a rod shape, transmits therethrough the light emitted by the light emitting unit, and guides the light in a longitudinal direction: a case that is formed into a rod shape, has a part open when viewed from the longitudinal direction, and houses the light guide rod therein; ribs provided so as to protrude from the light guide rod on both ends of the light guide rod in the longitudinal direction; and rib guide portions which are provided on both ends of the case in tire longitudinal direction, guide the ribs when the light guide rod is housed in the case, and restricts rotation of the light guide rod with respect to the case.

An optical system can include a optical receiver comprising an optical waveguide, an optical lid adjacent the waveguide, and a reflective surface proximate an output of the optical waveguide to direct light from the waveguide towards an output of the optical lid. The optical system can also include a photodetector (PD) die comprising a substrate, a concave mirror, and a photodetector. The concave mirror is formed on a first side of the substrate and the photodetector is disposed on a second side of the substrate, the first side opposite the second side, wherein the photodetector is disposed on the second side of the PD die offset from the optical axis of the optical element.

Methods and systems for split voltage domain receiver circuits are disclosed and may include amplifying complementary received signals in a plurality of partial voltage domains. The signals may be combined into a single differential signal in a single voltage domain. Each of the partial voltage domains may be offset by a DC voltage from the other partial voltage domains. The sum of the partial domains may be equal to a supply voltage of the integrated circuit. The complementary signals may be received from a photodiode. The amplified received signals may be amplified via stacked common source amplifiers, common emitter amplifiers, or stacked inverters. The amplified received signals may be DC coupled prior to combining. The complementary received signals may be amplified and combined via cascode amplifiers. The voltage domains may be stacked, and may be controlled via feedback loops. The photodetector may be integrated in the integrated circuit.

A semiconductor package including: a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

An endoscope including an image pickup module in a distal end section, wherein the image pickup module including an image pickup unit including an image pickup device, a light emitting element configured to emit an optical signal from a light emission surface, and a ferrule disposed in the image pickup unit, in which the light emission surface is inclined at a first angle of not less than 35 degrees nor more than 55 degrees to the distal end section central axis, a fiber distal end portion is inclined at a second angle of not less than 35 degrees nor more than 55 degrees to the distal end section central axis, and the optical fiber extends toward the distal end section central axis, and is arranged along a bending section central axis in a bending section.

The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.

An optical module includes an optical element, a first substrate, on a first principal plane of which the optical element is mounted, a holding member disposed on a second principal plane of the first substrate, an optical fiber inserted into a through hole of the holding member, a holding substrate with an opening, a wall surface of which is in contact with an outer peripheral surface of the holding member, an interconnecting substrate connecting the first substrate and the holding substrate, a side surface substrate, an end portion of which is connected to the holding substrate and on which an electrode is disposed, and a signal cable, a distal end portion of which is bonded to the electrode of the side surface substrate.

A semiconductor package including: a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.