The present invention relates to a metal card and a card manufacturing method, and the metal card includes a metal sheet, a machined part made of a plastic material in such a manner as to be inserted into one side surface of the metal sheet, an insulating sheet with a ferromagnetic insulating material in such a manner as to be attached to the underside of the metal sheet, and an inlay sheet with antenna coils in such a manner as to be attached to the underside of the insulating sheet, wherein the metal sheet has a machined part insertion portion formed on one side surface thereof to insert the machined part, and the ferromagnetic insulating material has the shape of one or more pieces or powder.

Disclosed in the present application are a backscatter transmitter and a signal transmission method, relating to the field of mobile communication. The backscatter transmitter comprises a processor, a receiving antenna, a transmitting antenna, and a keying switch; the processor is used for controlling the connection path between the receiving antenna and the transmitting antenna by means of controlling the keying switch; the receiving antenna is used for receiving a first radio frequency signal; the connection path is used for modulating the phase of the first radio frequency signal to obtain a modulated second radio frequency signal; and the transmitting antenna is used for transmitting the second radio frequency signal. Thus, provided is a novel backscatter transmitter that does not require the arrangement of a mixer and is capable of implementing modulation of the phase of a radio frequency signal by means of only the connection path between the receiving antenna and the transmitting antenna; the structure is simple, the implementation principles are simple, and there is no need for excessive power consumption. The processor can adjust the connection path between the receiving antenna and the transmitting antenna by means of controlling the keying switch, being highly flexible.

A lead frame used to assemble a semiconductor device, such as a smart card, has a first major surface including exposed leads and a second major surface including a die receiving area and one or more connection pads surrounding the die receiving area. The connection pads enable electrical connection of an Integrated Circuit (IC) die to the exposed leads. A molding tape sized and shaped like the lead frame is adhered to and covers the second major surface of the lead frame. The molding tape has a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant. The cut-out has an elevated sidewall for retaining the encapsulant within the cavity.

The present invention relates to a prelaminate for an electronic card, wherein at least a first group of pads is formed from a metal plate formed from a piece comprising a central part and branches extending from the central part, the branches of the metal plate forming the pads of the first group. The invention also relates to a method for producing such a prelaminate and an electronic card comprising such a prelaminate.

A biological sample storage container and a dual chip wireless identification tag thereof are provided. The dual chip wireless identification tag includes a substrate, an antenna structure, a first chip, and a second chip. The antenna structure is disposed on the substrate, and includes two radiation parts and two matching parts. The two matching parts are connected between the two radiation parts, the first chip is coupled to one of the matching parts, and the second chip is coupled to the other one of the matching parts.

An integrated radio frequency identification tag and tire pressure monitoring system sensor includes a radio frequency identification tag. The radio frequency identification tag includes an integrated circuit, and a printed circuit board carries the integrated circuit. A tire pressure monitoring system sensor is mounted on the radio frequency identification tag. An antenna includes at least one coil antenna wire. The antenna wire is formed in a helical shape and is electrically connected to the integrated circuit. A first end of the antenna wire is mounted to the printed circuit board. A mechanical interlock between the first end of the antenna wire and the printed circuit board includes features that secure the first end of the antenna wire to the printed circuit board.

An RFID includes a first conductive layer; a second conductive layer in which an antenna is formed; an insulating layer; and an IC chip. The antenna includes a first slot; a second slot facing the first slot; a coupling slot to couple the first slot with the second slot; a first adjustment slot coupled with one end of the first slot, and being wider than the first slot; a second adjustment slot coupled with another end of the first slot, and being wider than the first slot; a third adjustment slot coupled with one end of the second slot, and being wider than the second slot; a fourth adjustment slot coupled with another end of the second slot, and being wider than the second slot.

The invention relates to a method for producing a module having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.

A tamper-evident RFID Tag (100) and a method for manufacturing it. The method (500) may provide (510) at least one protection layer (151) before being cured (520) such as to turn the at least one protection layer (151) into at least one degradable layer (155), and to prevent an assembly or a reassembly of the tamper-evident RFID Tag (100) after any attempt of harvesting of the tamper-evident RFID Tag (100).

The method of manufacturing a functional inlay, comprises at least the steps of: (1) providing a substrate (7) with a wire antenna embedded therein and with an aperture (6) wherein two wire antenna portions (4,5) are positioned over said aperture (6); (2) acquiring the positions and the dimensions of said wire antenna portions (4,5) and of said aperture (6); (3) determining If the acquired positions and dimensions meet predetermined tolerances; (4) if the acquired dimensions and positions meet said tolerances, then placing a chip (1) in fie aperture (6) so that said wire portions (4,5) are positioned over connections pads (2,3) of said chip (1) and then bonding said wire portions (4,5) to said connection pads (2,3).