A receiver device of energy from the earth and its atmosphere for providing a supply of electric power.

Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.

Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.

A miniaturization process of passive electronic components is revealed. The miniaturization process mainly includes the steps of reforming, reacting at high temperature, preparing paste, dipping in the paste, light curing, packaging, heat curing, cutting pins, coating silver paste, heating and drying, and engraving by laser. The miniaturization process makes production of the passive components with thinner, smaller, and lightweight deign easier and the more convenient. The service life of the passive components is also extended and applications of the passive components are broader.

A miniaturization process of passive electronic components is revealed. The miniaturization process mainly includes the steps of reforming, reacting at high temperature, preparing paste, dipping in the paste, light curing, packaging, heat curing, cutting pins, coating silver paste, heating and drying, and engraving by laser. The miniaturization process makes production of the passive components with thinner, smaller, and lightweight deign easier and the more convenient. The service life of the passive components is also extended and applications of the passive components are broader.

In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.

In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.

A flexible cable includes an elongated flexible substrate including first and second surfaces on opposite sides thereof, a first capacitor electrode provided on the first surface side of the flexible substrate, the first capacitor electrode extending from a first end of the flexible substrate toward a second end of the flexible substrate, a second capacitor electrode provided on the second surface side of the flexible substrate, the second capacitor electrode extending from the second end of the flexible substrate toward the first end of the flexible substrate, a first connection portion provided at an end of the first capacitor electrode located at the first end of the flexible substrate, and a second connection portion provided at an end of the second capacitor electrode located at the second end of the flexible substrate.

A flexible cable includes an elongated flexible substrate including first and second surfaces on opposite sides thereof, a first capacitor electrode provided on the first surface side of the flexible substrate, the first capacitor electrode extending from a first end of the flexible substrate toward a second end of the flexible substrate, a second capacitor electrode provided on the second surface side of the flexible substrate, the second capacitor electrode extending from the second end of the flexible substrate toward the first end of the flexible substrate, a first connection portion provided at an end of the first capacitor electrode located at the first end of the flexible substrate, and a second connection portion provided at an end of the second capacitor electrode located at the second end of the flexible substrate.

An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements