A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C.sub.1 in the entire electrode facing portion satisfies about 10 wtppm<C.sub.1<about 50 wtppm. On an imaginary central axis line, a Cl concentration C.sub.2 in a central portion of the electrode facing portion and a Cl concentration C.sub.3 in both end portions of the electrode facing portion satisfy about 0.5C.sub.2≤C.sub.3<C.sub.2.

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C.sub.1 in the entire electrode facing portion satisfies about 10 wtppm<C.sub.1<about 50 wtppm. On an imaginary central axis line, a Cl concentration C.sub.2 in a central portion of the electrode facing portion and a Cl concentration C.sub.3 in both end portions of the electrode facing portion satisfy about 0.5C.sub.2≤C.sub.3<C.sub.2.

A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

A filter device includes an input terminal, an output terminal, a main body, a common electrode provided to the main body, a ground terminal, and LC parallel resonators connected to the common electrode and the ground terminal. Each LC parallel resonator includes a capacitor, a first via, and a second via. One end of the first via is connected to the common electrode, and another end thereof is connected to the ground terminal through the capacitor. One end of the second via is connected to the common electrode, and another end thereof is connected to the ground terminal without through the capacitor. The second via is connected between portions of the common electrode to which the first vias of two adjacent resonators are connected.

A filter device includes an input terminal, an output terminal, a main body, a common electrode provided to the main body, a ground terminal, and LC parallel resonators connected to the common electrode and the ground terminal. Each LC parallel resonator includes a capacitor, a first via, and a second via. One end of the first via is connected to the common electrode, and another end thereof is connected to the ground terminal through the capacitor. One end of the second via is connected to the common electrode, and another end thereof is connected to the ground terminal without through the capacitor. The second via is connected between portions of the common electrode to which the first vias of two adjacent resonators are connected.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being Ni, the internal electrode layers being alternately exposed to two end faces of the multilayer chip opposite to each other, and external electrodes, each of which is provided on each of the two end faces. Each of the external electrodes includes a base layer contacting the internal electrode layers, a main component of the base layer being Cu. The base layer includes Ni of 1 wt % or more and 10 wt % or less on a presumption that an amount of Cu is 100 wt %.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being Ni, the internal electrode layers being alternately exposed to two end faces of the multilayer chip opposite to each other, and external electrodes, each of which is provided on each of the two end faces. Each of the external electrodes includes a base layer contacting the internal electrode layers, a main component of the base layer being Cu. The base layer includes Ni of 1 wt % or more and 10 wt % or less on a presumption that an amount of Cu is 100 wt %.