A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.

A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.

A film capacitor that includes first and second dielectric films, first and second inner electrodes, and first and second outer electrodes. The first inner electrode includes a first connection portion, a first main electrode portion joined to the first connection portion and thinner than the first connection portion, and a first thin portion extending from the first main electrode portion and thinner than the first main electrode portion. The second inner electrode includes a second connection portion and a second main electrode portion joined to the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion across the first dielectric film. The second connection portion includes a reduction region having a thickness that decreases from the second connection portion toward the second main electrode portion. The first thin portion opposes the reduction region across the first dielectric film.

A metalized film includes a dielectric film having a first surface and a second surface opposite to the first surface. The dielectric film has a film thickness of 1 to 3 μm. The first surface has an arithmetic mean height. The second surface has an arithmetic mean height. The arithmetic mean heights are different. The first surface has a maximum height Sz1 satisfying the expression 100 nm<Sz1≤350 nm. The second surface has a maximum height Sz2 satisfying the expression 10 nm≤Sz2≤100 nm. The metalized film includes a metal film on the second surface.

A metalized film includes a dielectric film having a first surface and a second surface opposite to the first surface. The dielectric film has a film thickness of 1 to 3 μm. The first surface has an arithmetic mean height. The second surface has an arithmetic mean height. The arithmetic mean heights are different. The first surface has a maximum height Sz1 satisfying the expression 100 nm<Sz1≤350 nm. The second surface has a maximum height Sz2 satisfying the expression 10 nm≤Sz2≤100 nm. The metalized film includes a metal film on the second surface.

The insulating member is integrated with only one of the busbars by insert molding in which one of opposing plate members in either one of the busbars is used as an insert target. The insulating member includes an insulation active portion, a reinforcing portion and a connecting portion. The insulation active portion is disposed on a back-surface side of one of the opposing plate portions and is interposed between the back-surface side and the other one of the opposing plate portions. The reinforcing portion is disposed on the front-surface side of the one of the opposing plate portions.

The connecting portion serves to connect the insulation active portion and the reinforcing portion into an integral unit. In the insulating member, lower end regions of the insulation active portion, reinforcing portion and connecting portion, which are close to the capacitor element and extending from an upper-surface side to a lower-surface side of a side plate portion, are embedded in a mold resin that covers the side plate portion.

A capacitor is disclosed that includes a plurality of electrically conductive capacitor layers wound around a winding center and a cooling channel, wherein the cooling channel is disposed between the capacitor layers, and wherein the cooling channel is electrically conductive. A system and a motor vehicle that includes the capacitors is also disclosed.

A capacitor is disclosed that includes a plurality of electrically conductive capacitor layers wound around a winding center and a cooling channel, wherein the cooling channel is disposed between the capacitor layers, and wherein the cooling channel is electrically conductive. A system and a motor vehicle that includes the capacitors is also disclosed.

A film capacitor that includes a dielectric resin film made of a thermosetting urethane resin; and a metal layer on at least one surface of the dielectric resin film, wherein the dielectric resin film contains at least an isocyanate group and a carbonyl group, and a ratio of a first absorption peak intensity of the isocyanate group in a wave number range of 2200 cm.sup.−1 to 2350 cm.sup.−1 to a second absorption peak intensity of the carbonyl group in a wave number range of 1650 cm.sup.−1 to 1800 cm.sup.−1 is 0.08 to 1.15.

A film capacitor that includes a dielectric resin film made of a thermosetting urethane resin; and a metal layer on at least one surface of the dielectric resin film, wherein the dielectric resin film contains at least an isocyanate group and a carbonyl group, and a ratio of a first absorption peak intensity of the isocyanate group in a wave number range of 2200 cm.sup.−1 to 2350 cm.sup.−1 to a second absorption peak intensity of the carbonyl group in a wave number range of 1650 cm.sup.−1 to 1800 cm.sup.−1 is 0.08 to 1.15.