This optical transmission module includes: a plurality of semiconductor lasers provided on a sub-mount fixed to a side surface of a block fixed on a plate-shaped stem made of metal; and a cap with a lens fixed thereto, the cap covering all members placed above the stem. The same number of lead pins as the semiconductor lasers are provided so as to respectively penetrate through a plurality of holes formed in the stem. The lead pins and the semiconductor lasers are electrically connected to each other, respectively. Single-phase electrical signals with the stem as a ground potential are respectively applied to the semiconductor lasers from an external power supply, through the lead pins, respectively, so as to cause modulation and oscillation of the semiconductor lasers.

A device is provided. The device includes a bridge layer over a first substrate. A first connector electrically connecting the bridge layer to the first substrate. A first die is coupled to the bridge layer and the first substrate, and a second die is coupled to the bridge layer.

Embodiments described herein provide techniques for forming a solder mask having a repeating pattern of features formed therein. The repeating pattern of features can be conceptually understood as a plurality of groove structures formed in the solder mask. The solder mask can be included in a semiconductor package that comprises the solder mask over a substrate and a molding compound over the solder mask that conforms to the repeating pattern of features. Several advantages are attributable to embodiments of the solder mask described herein. One advantage is that the repeating pattern of features formed in the solder mask increase the contact area between the solder mask and the molding compound. Increasing the contact area can assist with increasing adherence and conformance of the molding compound to the solder mask. This increased adherence and conformance assists with minimizing or eliminating interfacial delamination.

A semiconductor device, including a semiconductor chip having a first electrode on a rear surface thereof, a laminated substrate including a heat dissipation board laminated on a rear surface of an insulating board, and a case. The case includes a frame surrounding an opening penetrating the case from a front surface to a rear surface thereof, the frame being in contact with a periphery of the laminated substrate covering the opening from the rear surface of the case, and a first terminal penetrating the frame. The first terminal includes a first connection part penetrating the frame and extending out of the frame, and a first wiring part provided in the opening. The first wiring part has a wiring rear surface disposed on a front surface of the insulating board, and a wiring front surface mechanically and electrically connected to the first electrode of the semiconductor chip.

A semiconductor device, including a semiconductor chip having a first electrode on a rear surface thereof, a laminated substrate including a heat dissipation board laminated on a rear surface of an insulating board, and a case. The case includes a frame surrounding an opening penetrating the case from a front surface to a rear surface thereof, the frame being in contact with a periphery of the laminated substrate covering the opening from the rear surface of the case, and a first terminal penetrating the frame. The first terminal includes a first connection part penetrating the frame and extending out of the frame, and a first wiring part provided in the opening. The first wiring part has a wiring rear surface disposed on a front surface of the insulating board, and a wiring front surface mechanically and electrically connected to the first electrode of the semiconductor chip.

A light emitting device includes: a substrate; a light emitting region including light emitting elements arranged in a matrix on the substrate; and a sealing portion located on the light emitting region. A single lens covering the light emitting region is formed in the sealing portion. Furthermore, a method for manufacturing a light emitting device includes: a step of forming a light emitting region including light emitting elements arranged in a matrix on a substrate; and a step of performing sealing by forming a single lens covering the light emitting region.

A semiconductor module includes a first case having a first side face, a first insulating paper disposed on the first case and having a first width in a first direction and having a notch with a second width smaller than the first width, a first terminal between the first case and the first insulating paper, having an exposed portion exposed from the first insulating paper at an area where the notch is formed, and a second terminal on the first insulating paper at a side opposite to a side where the first terminal is disposed. The first terminal and the first insulating paper have extended portions extending to an outside of the first case from the first side face so that a portion of the first insulating paper where the notch is formed and the exposed portion of the first terminal are located at the outside of the first case.

A semiconductor module includes a first case having a first side face, a first insulating paper disposed on the first case and having a first width in a first direction and having a notch with a second width smaller than the first width, a first terminal between the first case and the first insulating paper, having an exposed portion exposed from the first insulating paper at an area where the notch is formed, and a second terminal on the first insulating paper at a side opposite to a side where the first terminal is disposed. The first terminal and the first insulating paper have extended portions extending to an outside of the first case from the first side face so that a portion of the first insulating paper where the notch is formed and the exposed portion of the first terminal are located at the outside of the first case.

A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.

A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.