A micro lighting device includes a substrate, an isolation layer formed on the substrate, a side-emission micro device, and a switching device. The side-emission micro device includes a first electrode, a second electrode and an emission surface. The side-emission micro device is disposed in a way so that the emission surface is perpendicular or parallel to the surface of the substrate. The switching device includes a first end, a second end coupled to the first electrode, and a control end.

A micro lighting device includes a substrate, an isolation layer formed on the substrate, a side-emission micro device, and a switching device. The side-emission micro device includes a first electrode, a second electrode and an emission surface. The side-emission micro device is disposed in a way so that the emission surface is perpendicular or parallel to the surface of the substrate. The switching device includes a first end, a second end coupled to the first electrode, and a control end.

A light-emitting audio device, an audio output device, and a display device. The light-emitting audio device includes a micro device integrated with a micro LED device and piezoelectric device. Both image display and audio output can be enabled using a single device. Audio is output using a plurality of light-emitting audio devices disposed in a plurality of subpixels, respectively. An increase in the thickness of the display device due to integrate with a audio function can be minimized. A variety of audio output functions are provided by driving the light-emitting audio devices according to areas.

A light-emitting audio device, an audio output device, and a display device. The light-emitting audio device includes a micro device integrated with a micro LED device and piezoelectric device. Both image display and audio output can be enabled using a single device. Audio is output using a plurality of light-emitting audio devices disposed in a plurality of subpixels, respectively. An increase in the thickness of the display device due to integrate with a audio function can be minimized. A variety of audio output functions are provided by driving the light-emitting audio devices according to areas.

A multi-view display device, in which first to third red subpixels configured to display first-first to first-third view images are defined by dividing a red subpixel on which a first organic light emitting layer is deposited, first to third green subpixels configured to display second-first to second-third view images are defined by dividing a green subpixel on which a second organic light emitting layer is deposited, and first to third blue subpixels configured to display third-first to third-third view images are defined by dividing a blue subpixel on which a third organic light emitting layer is formed.

A multi-view display device, in which first to third red subpixels configured to display first-first to first-third view images are defined by dividing a red subpixel on which a first organic light emitting layer is deposited, first to third green subpixels configured to display second-first to second-third view images are defined by dividing a green subpixel on which a second organic light emitting layer is deposited, and first to third blue subpixels configured to display third-first to third-third view images are defined by dividing a blue subpixel on which a third organic light emitting layer is formed.

The present application discloses a light-emitting array, comprising a first light-emitting chip; a second light-emitting chip; and a conductive line electrically connected to the first light-emitting chip and the second light-emitting chip, wherein the conductive line includes a first segment and a second segment having a radius curvature different from that of the first segment.

A method for manufacturing a micro light emitting diode device is provided. A connection layer and epitaxial structures are formed on a substrate. A first pad is formed on each of the epitaxial structures. A first adhesive layer is formed on the connection layer, and the first adhesive layer encapsulates the epitaxial structures and the first pads. A first substrate is connected to the first adhesive layer. The substrate is removed, and a second substrate is connected to the connection layer through a second adhesive layer. The first substrate and the first adhesive layer are removed. The connection layer located between any two adjacent epitaxial structures are partially removed to form a plurality of connection portions. Each of the connection portions is connected to the corresponding epitaxial structure, and a side edge of each of the connection portions protrudes from a side wall surface of the corresponding epitaxial structure.

A method for manufacturing a micro light emitting diode device is provided. A connection layer and epitaxial structures are formed on a substrate. A first pad is formed on each of the epitaxial structures. A first adhesive layer is formed on the connection layer, and the first adhesive layer encapsulates the epitaxial structures and the first pads. A first substrate is connected to the first adhesive layer. The substrate is removed, and a second substrate is connected to the connection layer through a second adhesive layer. The first substrate and the first adhesive layer are removed. The connection layer located between any two adjacent epitaxial structures are partially removed to form a plurality of connection portions. Each of the connection portions is connected to the corresponding epitaxial structure, and a side edge of each of the connection portions protrudes from a side wall surface of the corresponding epitaxial structure.

The present invention provides a micro light-emitting-diode display panel and a manufacturing method thereof. The micro light-emitting-diode display panel which presses and fixes the micro light-emitting-diodes into a resin adhesive layer by filling the resin adhesive layer in the pixel groove. Meanwhile, the electrode at the bottom of the micro light-emitting-diode is guided to the top of the micro light-emitting-diode by the connection electrode, making the two electrodes of the micro light-emitting-diode are at the top, to facilitate the connection between the electrodes of the micro light-emitting-diode and the electrode points, which can reduce the difficulty of the electrode bonding of the micro light-emitting-diode, and improve the reliability of the electrode bonding of the micro light-emitting-diode.