A light-emitting device includes a substrate, a plurality of light-emitting diode (LED) dies, a first reflection layer, and a second reflection layer. The LED dies are on the substrate. The first reflection layer is on the LED dies. The second reflection layer is on the first reflection layer. The first reflection layer is configured to reflect a waveband of light emitted from the LED dies. The second reflection layer is configured to reflect a laser waveband, wherein the wavelength of the laser waveband is less than 420 nm.

A display device includes including emission areas, a non-emission area. Light emitting elements are disposed on a substrate in the emission areas. A bank is disposed on the substrate in the non-emission area of the substrate and includes openings corresponding to the emission areas. Color conversion patterns are disposed in the openings of the bank and converts a wavelength band of light incident from the light emitting elements to emit light. Organic patterns are disposed on the color conversion patterns and are separated from each other. Color filters are disposed on the organic patterns. The color filters are sequentially stacked in a space between the organic patterns in the non-emission area.

According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, an LED mounted to the circuit board that is configured to emit light with an angular CCT deviation, a lens assembly mounted to the circuit board over the LED and configured to receive the light emitted from the LED and reduce the angular CCT deviation of the light received from the LED to make a color temperature of the light received from the LED more uniform, and an elastomer encapsulating at least part of the circuit board that is separate and distinct from the lens assembly.

The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprising: a light-emitting stack; and a semiconductor layer having a first surface connecting to the light-emitting stack, a second surface opposite to the first surface, and a void; wherein the void comprises a bottom part near the first surface and an opening on the second surface, and a dimension of the bottom part is larger than the dimension of the opening.

LED arrays with diffusing elements are disclosed. In various embodiments, diffusing elements in the form of one or more structures of a diffuser material may be provided between an LED array and an optical element that collects light emitted by the array and directs the light to an optical far field. The optical element may image or approximately image the LED array. The diffusing elements at least partially blur patterning in the far field illumination that may otherwise arise from the optical element imaging the array. Each LED may be a wavelength-converting LED in that it may include a light emitter arrangement and a wavelength-converter structure.

Techniques for tuning the illumination pattern of a Light Emitting Diode (LED) are described. An example image capture system incorporates an LED with an integrated micro-reflector. The example image capture system includes a camera to capture an image of an object and a Light Emitting Diode (LED) to emit light for illuminating the object. The LED includes a light emitting layer and a window layer made of transparent semiconductor material disposed over the light emitting layer. The shape of the window layer creates a plurality of reflectors that generate a specified illumination pattern that reduces the effect of illuminance distortions created by the image capture system.

A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.

A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.

A pixel includes: an emission area and a non-emission area; a via layer including a lower surface and an upper surface, the via layer including a first part having a first thickness, and a second part having a second thickness; a first alignment electrode and a second alignment electrode on the via layer and spaced from each other; an insulating layer on the via layer, the first alignment electrode, and the second alignment electrode, the insulating layer having a planar surface; a first electrode and a second electrode in the emission area and spaced from each other; and light emitting elements on the planer surface of the insulating layer in the emission area, and electrically connected to the first electrode and the second electrode. The first and second alignment electrodes may be on the second part of the via layer and overlap the second part of the via layer.

A light-emitting array includes a semiconductor LED structure, multiple transparent dielectric bodies, a set of multiple, independent first electrical contacts, and a set of second electrical contacts. The LED structure extends contiguously over the array. The second electrical contacts are in electrical contact with the second semiconductor layer. Each dielectric body protrudes away from the first semiconductor layer and has on its surface an electrically conductive layer in electrical contact with the first semiconductor layer, forming a portion of a corresponding one of the first electrical contacts. Each dielectric body and corresponding first electrical contact define a corresponding discrete, circumscribed pixel region within the contiguous area of the array, each pixel region separate from the others. Some light emitted in the pixel region propagates into the dielectric body, undergoes internal reflection(s) within the dielectric body, and propagates out of the array through the dielectric body and diode structure.