A light emitting diode package structure and a manufacturing method thereof and a display device are provided. The light emitting diode package structure includes a blue light emitting diode and a phosphor layer. The phosphor layer is disposed on the blue light emitting diode package structure, and the phosphor layer includes an encapsulation layer and a plurality of phosphor powders. The phosphor powders are disposed in the encapsulation layer and consist of green phosphor powders, red phosphor powders, and yellow phosphor powders, in which a weight percentage of the yellow phosphor powders ranges from 1% to 10%.

An LED package structure and a method of manufacturing the same, and an LED display are provided. The method of manufacturing the LED package structure includes: providing a plurality of LED chips, each of the LED chips having two exposed conductive pads; forming a plurality of quantum dot material layers for respectively enclosing the LED chips; and respectively forming a plurality of blue light scattering material layers on the quantum dot material layers. The LED package structure includes the LED chip that has the two exposed conductive pads, the quantum dot material layer for enclosing the LED chip, and the blue light scattering material layer that is disposed on the quantum dot material layer.

A display device comprises a first substrate, a conductive layer including a first electrode on the first substrate, an interlayer insulating layer on the conductive layer, a via layer on the interlayer insulating layer and including a hole exposing a part of a top surface of the interlayer insulating layer, a second electrode spaced apart from the hole and on the via layer, light emitting elements inside the hole of the via layer, a first contact electrode electrically connected to the first electrode and a first end of the light emitting elements, and a second contact electrode on the via layer and electrically connected to a second end of the light emitting elements. At least a part of the light emitting elements are placed on an inner wall of the hole.

An ink composition including a nanomaterial and a liquid vehicle, wherein the liquid vehicle includes a composition including one or more functional groups that are capable of being cross-linked is disclosed. An ink composition including a nanomaterial, a liquid vehicle, and scatterers is also disclosed. An ink composition including a nanomaterial and a liquid vehicle, wherein the liquid vehicle includes a perfluorocompound is further disclosed. A method for inkjet printing an ink including nanomaterial and a liquid vehicle with a surface tension that is not greater than about 25 dyne/cm is disclosed. In certain preferred embodiments, the nanomaterial includes semiconductor nanocrystals. Devices prepared from inks and methods of the invention are also described.

Provided are a nanostructure network and a method of fabricating the same. The nanostructure network includes nanostructures having a poly-crystalline structure formed by self-assembly of the nanostructures. The method includes preparing a nanostructure solution in which nanostructures are dispersed in a first solvent, forming a nanostructure ink by adding the nanostructure solution into a second solvent having a viscosity higher than that of the first solvent, coating a surface of a substrate with the nanostructure ink, and forming a nanostructure network by evaporating the first solvent and the second solvent included in the nanostructure ink coated on the substrate.

An LED filament includes LED chips, two conductive electrodes, and an enclosure. The LED chips are arranged in an array along an axial direction of the LED filament and are electrically connected with one another. The two conductive electrodes are disposed corresponding to the array. Each of the two conductive electrodes is electrically connected to a corresponding LED chip at an end of the array. The enclosure is coated on two or more sides of the array and the two conductive electrodes. A portion of each of the two conductive electrodes is exposed from the enclosure. An axis of the LED filament is parallel with the axial direction, and a radial direction of the LED filament is perpendicular to the axial direction. Postures of at least a part of the LED chips related to an axis are different from each other on the radial direction.

A light-emitting device includes: a substrate having a top surface, wherein the top surface comprises a first portion and a second portion; a first semiconductor stack on the first portion, comprising a first upper surface and a first side wall; and a second semiconductor stack on the first upper surface, comprising a second upper surface and a second side wall, and wherein the second side wall connects the first upper surface; wherein the first semiconductor stack comprises a dislocation stop layer; wherein the dislocation stop layer comprises AlGaN; and wherein the first side wall and the second portion of the top surface form an acute angle a between thereof

According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit light, a lens disposed over the LED having a bottom surface facing the circuit board, a top surface opposite the bottom surface, and a lateral surface between the top and bottom surfaces, and an elastomer encapsulating at least part of the circuit board. The elastomer may not be in contact with at least part of the lateral surface of the lens so as to form a gap between the elastomer and the lateral surface of the lens.

An adhesive layer is disclosed and may include a plurality of short chain molecules, each of the plurality of the short chain molecules including a first end and a second end such that the distance between the first end and second end is less than 100 nm and such that first end is configured to attach to a first surface and the second end is configured to attach to a second surface.

A light source unit includes a plate including a front surface and a rear surface opposite to the front surface, a light scattering section on the front surface of the plate, a light controlling section on the light scattering section and including a plurality of quantum dots, a light source on the rear surface of the plate and including a light emitting element which generates light, a light emitting surface from which the light is emitted, and a plurality of lead frames connected to the light emitting element. The light source provides light from the rear surface of the plate toward the light controlling section. The light emitting surface of the light source is in contact with the rear surface of the plate.