An omnidirectional vertically polarized antenna. A number of antenna elements are each fabricated on a backing, such as a printed circuit board. The front of each antenna element has conductive strips and slots, arranged in an alternating pattern. The back of each antenna element has an antenna feed circuit. An electrically absorptive layer is attached to the back of each antenna element. The antenna elements are assembled together in a nonconductive housing with circumferentially arranged compartments that receive the antenna elements.

Methods and apparatus for a radiator assembly having a feed circuit with an air interface to a quadridge feed structure to excite an antenna, such as a stacked patch antenna. Embodiments of the assembly can provide enhanced bandwidth, scan angle performance, and coincident phase centers for dual-linear polarizations.

This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.

This document describes waveguides that use a combination of air dielectric filled channels and non-air dielectric filled channels to obtain beneficial attributes of both air and dielectric waveguides. EM energy loss inside the waveguide compares to a traditional air waveguide. However, with a smaller size than a comparable air waveguide, the example waveguide can occupy less area of a chip or package than a comparable air waveguide of a traditional design. The waveguide has a routing portion with hollow channels filled with an air dielectric. Radiation channels corresponding to each of the hollow channels are loaded with a non-air dielectric. A surface of each of the radiation channels allows EM energy to escape the non-air dielectric. The described waveguide may be particularly advantageous for use in an automotive context, for example, detecting objects in a roadway in a travel path of a vehicle.

An electronic device includes a housing including an internal space, a display disposed in the internal space, the display being visible from an outside of the electronic device through at least a part of the housing, at least one first antenna disposed in the internal space, a second antenna disposed in the internal space and wound multiple times and including a conductive pattern disposed to be spaced apart from the first antenna, a first wireless communication circuit configured to transmit or receive a wireless signal in a first frequency band via the at least one first antenna, and a second wireless communication circuit configured to transmit or receive a wireless signal in a second frequency band via the second antenna, wherein the at least one first antenna is spaced apart by a distance from the conductive pattern.

The present disclosure relates to a radiation assembly, a waveguide antenna sub-arrays, and a waveguide array antenna. The radiation assembly for the waveguide array antenna comprises: a first radiation layer having a plurality of first radiation windows, each of the plurality of first radiation windows has a metal grid that divides the corresponding first radiation window into two radiation holes; and a second radiation layer having a plurality of second radiation windows, the plurality of second radiation windows has a one-to-one correspondence with the plurality of first radiation windows, and the plurality of second radiation windows of the second radiation layer do not have a metal grid. The thickness of the second radiation layer is greater than the thickness of the first radiation layer, and the first radiation layer and the second radiation layer are manufactured independently of each other.

An antenna array is provided that includes a plurality of radiating elements and one or more combiners. The plurality of radiating elements and the combiners are formed as a single indivisible metal element by use of additive manufacturing processes.

A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.

A unit cell can be used for a metasurface, metamaterial, or beamforming antenna. The unit cell includes a metal layer attached to a substrate. The metal layer defines an iris opening for the unit cell. One or more tunable capacitance devices are positioned within or across the iris opening. Each tunable capacitance device is to tune resonance frequency of the unit cell. Mass transfer technologies or self-assembly processes may be used to position the tunable capacitance devices.

The present disclosure provides a signal conditioner, an antenna device and a manufacturing method. The signal conditioner includes: a microstrip line including a first portion and a second portion; an insulating layer including a first insulating layer covering the first portion; at least one electrode; a liquid crystal layer covering the microstrip line, the insulating layer, and the at least one electrode; and a common electrode line. A first end of the first portion is connected to a first end of the second portion. A second end of the first portion is connected to a second end of the second portion. The at least one electrode includes a first electrode on a side of the first insulating layer facing away from the first portion. The common electrode line is on a side of the liquid crystal layer facing away from the microstrip line.