An amplifier includes a semiconductor substrate. A first conductive feature partially covers the bottom substrate surface to define a conductor-less region of the bottom substrate surface. A first current conducting terminal of a transistor is electrically coupled to the first conductive feature. Second and third conductive features may be coupled to other regions of the bottom substrate surface. A first filter circuit includes an inductor formed over a portion of the top substrate surface that is directly opposite the conductor-less region. The first filter circuit may be electrically coupled between a second current conducting terminal of the transistor and the second conductive feature. A second filter circuit may be electrically coupled between a control terminal of the transistor and the third conductive feature. Conductive leads may be coupled to the second and third conductive features, or the second and third conductive features may be coupled to a printed circuit board.

A distributed amplifier includes an input transmission circuit, an output transmission circuit, at least one cascode amplifier coupled between said input and output transmission circuits. Each cascode amplifier includes a first common-gate configured transistor coupled to the output transmission circuit, a common-source configured transistor coupled between the input transmission circuit and the common-gate configured transistor, and a second common-gate configured transistor coupled between the first common-gate configured transistor and common-source configured transistor.

Various envelope tracking amplifiers are presented that can be switched between an ET (envelope tracking) mode and a non-ET mode. Switches and/or tunable components are utilized in constructing the envelope tracking amplifiers that can be switched between the ET mode and the non-ET mode.

A power amplification circuit that includes: a capacitor element in which a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer are sequentially stacked, the capacitor element including a first capacitor in which the first metal layer serves as one electrode thereof and the second metal layer serves as another electrode thereof, and a second capacitor in which the second metal layer serves as one electrode thereof and the third metal layer serves as another electrode thereof; and a transistor that amplifies a radio-frequency signal. The radio-frequency signal is supplied to the one electrode of the first capacitor. The other electrode of the first capacitor and the one electrode of the second capacitor are connected to a base of the transistor, and the other electrode of the second capacitor is connected to the emitter of the transistor.

A distributed amplifier with improved stabilization includes an input transmission circuit, an output transmission circuit, at least one cascode amplifier coupled between said input and output transmission circuits. Each cascode amplifier includes a common-gate configured transistor coupled to the output transmission circuit, and a common-source configured transistor coupled between the input transmission circuit and the common-gate configured transistor. The distributed amplifier also includes a non-parasitic resistance and capacitance coupled in series between a drain and a gate of at least one of the common-gate configured transistors for increasing the amplifier stability.

A microwave semiconductor device of an embodiment includes a package, a semiconductor amplifying element, an output matching circuit, and a smoothing circuit. The package includes a metal base plate, a frame body bonded to a surface of the metal base plate, an input feedthrough part, and an output feedthrough part. The semiconductor amplifying element has an output electrode. The output matching circuit includes an output matching capacitor, and a first bonding wire connected to the output matching capacitor and the output electrode. The smoothing circuit includes a smoothing capacitor, and a second bonding wire. The smoothing capacitor is connected by the second bonding wire to a position in the output matching circuit at which capacitive reactance component of a load impedance seen from the output matching capacitor is smaller than inductive reactance component of the load impedance seen from the output electrode of the semiconductor amplifying element.

Apparatus and methods for envelope tracking systems are provided. In certain configurations, an envelope tracking system includes a digital filter that generates a filtered envelope signal based on a digital envelope signal representing an envelope of a radio frequency signal, a buck converter controllable by the filtered envelope signal and including an output electrically connected to a power amplifier supply voltage, a digital-to-analog converter module including an output electrically connected to the output of the buck converter and that provides an output current, and a digital shaping and delay circuit configured to generate a shaped envelope signal based on shaping the filtered envelope signal. The shaped envelope signal controls a magnitude of the output current, and the digital shaping and delay circuit controls a delay of the shaped envelope signal to align the output of the digital-to-analog converter module and the output of the buck converter.

Embodiments disclosed herein relate to a bias circuit that uses Schottky diodes. Typically, a bias circuit will include a number of transistors used to generate a bias voltage or a bias current for a power amplifier. Many wireless devices include power amplifiers to facilitate processing signals for transmission and/or received signals. By substituting the bias circuit design with a design that utilizes Schottky diodes, the required battery voltage of the bias circuit may be reduced enabling the use of lower voltage power supplies.

A wireless power transmitter may comprise: a signal generation unit which generates a differential signal; an amplifier which amplifies the differential signal with a predetermined gain; a resonance unit which generates an electromagnetic wave using the amplified differential signal and radiates the same; and a signal adjustment unit which senses at least one of the current and the voltage of the amplified differential signal at the input terminal of the resonance unit, and adjusts at least one of the phase and the amplitude of the differential signal output from the signal generation unit, on the basis of the result of the sensing.

An amplifier includes a semiconductor substrate. A first conductive feature partially covers the bottom substrate surface to define a conductor-less region of the bottom substrate surface. A first current conducting terminal of a transistor is electrically coupled to the first conductive feature. Second and third conductive features may be coupled to other regions of the bottom substrate surface. A first filter circuit includes an inductor formed over a portion of the top substrate surface that is directly opposite the conductor-less region. The first filter circuit may be electrically coupled between a second current conducting terminal of the transistor and the second conductive feature. A second filter circuit may be electrically coupled between a control terminal of the transistor and the third conductive feature. Conductive leads may be coupled to the second and third conductive features, or the second and third conductive features may be coupled to a printed circuit board.