A solid state power amplifier uses a Doherty power amplifier that can be implemented as a monolithic microwave integrated circuit. By adjusting the DC bias of the amplifying stages in each branch of the Doherty amplifier, the output power, linearity, and DC power can be adjusted to provide a specified output, where the specification for the output can include the maintaining of desired DC power and linearity. The Doherty power amplifier can be used in a satellite payload or other application utilizing solid state power amplifiers, while providing the proper amount of RF output power and DC power. A single amplifier can have its bias levels adjusted for different output levels, helping to minimize the number of designs that are required for a given satellite payload, reducing the variety of parts in a satellite payload.

A method includes generating a first current through a first node based on a differential pair of signals received by a differential pair of input nodes of a differential circuit of a first integrated circuit die of an isolator product. The method includes generating a second current through a second node. The second current matches the first current through the first node and is based on an attenuated version of an output measurement signal. The method includes generating the output measurement signal having a level corresponding to an average amplitude of the differential pair of signals based on the first current and the second current.

The driver circuit includes DC cut capacitors, an input buffer, input termination resistors connected in series between differential input signal terminals and an ESD protection circuit connected to a connection point of the input terminal resistors. The ESD protection circuit includes diodes.

The invention relates to a radio frequency assembly comprising a radio frequency circuit comprising at least one group of N≥2 amplifiers (A1, A2) disposed in series on a substrate (1), said assembly comprising a package (2) wherein the substrate (1) is disposed, each amplifier comprising a local grounding point (b1, b2, b3) and a local feed point (a1, a2, a3), said common grounding points being connected to a common ground (GND) outside the package (2), said common feed points being connected to a common power supply (VDD) outside the package, said assembly comprising at least N−1 parallel LC circuits disposed between the common power supply (VDD) and the local feed point (a2, a3) of an amplifier (A2) so as to attenuate the current loops between two amplifiers in series.

A communication circuit, including a first supply modulator configured to provide a first supply voltage; a first power amplifier configured to generate a first output signal by amplifying a first input signal corresponding to a first operation frequency band; a second power amplifier configured to generate a second output signal by amplifying a second input signal corresponding to a second operation frequency band; and a switching circuit configured to selectively provide the first supply voltage from the first supply modulator to the second power amplifier based on a first switching signal according to an operation mode.

An electronic device is provided. The electronic device may include a plurality of antennas configured to transmit and receive a signal in a radio frequency (RF) frequency band; and an RF circuit configured to process the signal in the RF frequency band. The RF circuit includes a reception (Rx) path configured to transfer a first signal received through the plurality of antennas, a transmission (Tx) path configured to transfer a second signal to the plurality of antennas, and a coupler configured to transfer at least a part of the second signal obtained in the Tx path to the Rx path. The Tx path includes a power divider configured to distribute power to at least one antenna among the plurality of antennas, and the coupler is electrically connected to an input terminal of the power divider to be disposed before the power divider.

An electronic device is disclosed. The electronic device may include an antenna for transmitting and receiving a signal in an RF frequency band, and an RF circuit for processing the signal in the RF frequency band. The RF circuit may include an Rx path for transferring a first signal received through the antenna, a Tx path for transferring a second signal output from an amplifier to the antenna, and a coupler for transferring at least a part of the second signal obtained in the Tx path to the Rx path. In addition, various embodiments understood from the specification are possible.

Provided is an amplification circuit for amplifying an input signal. The amplification circuit includes an input stage including an input matching circuit that receives the input signal and an input attenuation circuit that attenuates a gain for the input signal outside an operating frequency band of the amplification circuit, a transistor that amplifies the input signal provided from the input stage, and an output stage including an output matching circuit that receives a signal amplified by the transistor and an output attenuation circuit that attenuates the gain for the input signal outside the operating frequency band of the amplification circuit, and the input attenuation circuit includes a first resistor and a second resistor that are connected to a ground voltage, a first passive element connected between the input matching circuit and the second resistor, and a second passive element connected between the first passive element and the first resistor.

A method for calibrating a receiver of an isolator product includes adjusting a peaking frequency of a receiver signal path of a first integrated circuit die of the isolator product and a gain of the receiver signal path based on a predetermined peaking frequency, a predetermined gain, a first level of a diagnostic signal during a first interval, and a second level of the diagnostic signal during a second interval. The first interval and the second interval are non-overlapping intervals. The method may include receiving a calibration signal on a differential pair of nodes of the receiver signal path of the first integrated circuit die. The method may include generating a diagnostic signal corresponding to an average amplitude of a received version of the calibration signal.

A semiconductor device includes an equalizer for receiving a first signal and outputting a second signal that has been adjusted to compensate for attenuation of the first signal. A filter is connected to the output terminal of the equalizer. A cancellation circuit operates to cancel a DC offset in the output of the equalizer. A processing circuit is configured to control the cancellation circuit to cancel the DC offset according to an output from the filter. The processing circuit sets a time constant for the filter to a first value to permit the cancellation circuit to cancel the DC offset when the equalizer is in a first state, and then sets the time constant to a second value when the equalizer is set to a second state to permit the cancellation circuit to cancel the DC offset when the equalizer is in the second state.