Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.

A multiple-stage amplifier includes a driver stage die and a final stage die. The driver stage die includes a first type of semiconductor substrate (e.g., a silicon substrate), a first transistor, and an integrated portion of an interstage impedance matching circuit. A control terminal of the first transistor is electrically coupled to an RF signal input terminal of the driver stage die, and the integrated portion of the interstage impedance matching circuit is electrically coupled between a current-carrying terminal of the first transistor and an RF signal output terminal of the driver stage die. The second die includes a III-V semiconductor substrate (e.g., a GaN substrate) and a second transistor. A connection, which is a non-integrated portion of the interstage impedance matching circuit, is electrically coupled between the RF signal output terminal of the driver stage die and an RF signal input terminal of the final stage die.

A multiple-stage amplifier includes a driver stage die and a final stage die. The driver stage die includes a first type of semiconductor substrate (e.g., a silicon substrate), a first transistor, and an integrated portion of an interstage impedance matching circuit. A control terminal of the first transistor is electrically coupled to an RF signal input terminal of the driver stage die, and the integrated portion of the interstage impedance matching circuit is electrically coupled between a current-carrying terminal of the first transistor and an RF signal output terminal of the driver stage die. The second die includes a III-V semiconductor substrate (e.g., a GaN substrate) and a second transistor. A connection, which is a non-integrated portion of the interstage impedance matching circuit, is electrically coupled between the RF signal output terminal of the driver stage die and an RF signal input terminal of the final stage die.

A transistor circuit includes a transistor having a gate terminal and first and second conduction terminals, a first circuit configured to convert an AC input signal of the transistor circuit to a gate bias voltage and to apply the gate bias voltage to the gate terminal of the transistor, a second circuit configured to convert the AC input signal of the transistor circuit to a control voltage, and a switching circuit configured to apply a first voltage to the first conduction terminal of the transistor in response to the control voltage.

A pseudo-resistor structure, comprises: a first and a second PMOS transistor or PN diode configured as two-terminal devices, wherein the positive terminal of the first PMOS transistor or PN diode is connected to the positive terminal of the second PMOS transistor or PN diode, and wherein the negative terminal of the first PMOS transistor or PN diode is connected to an input (A) of the pseudo-resistor structure and wherein the negative terminal of the second PMOS transistor or PN diode is connected to an output (C) of the pseudo-resistor structure, and a dummy transistor or dummy diode connected to the input (A), wherein the dummy transistor or dummy diode is further connected to a bias voltage for compensating a leakage current through the first and the second PMOS transistors or PN diodes. A closed-loop operational amplifier circuit comprising the pseudo-resistor structure is provided. Also, a bio-potential sensor comprising the closed-loop operational amplifier circuit is provided.

A MIMO amplifier circuit operable to couple one or more selectable input ports to one or more selectable output ports. The circuit includes N input transistors and M output transistors. Each input transistor has its base coupled to a respective input port node, its emitter coupled to ground, and its collector connected to an intermediate node. Each output transistor has its base coupled to a bias node, its emitter connected to the intermediate node, and its collector coupled to a respective output port nodes. Each input transistor enables the respective input port node when its base is biased. Each output transistor enables the respective output port node when its bias node is asserted. The base of the input transistor for each enabled port is biased to provide a quiescent current I.sub.0*m/n through that input transistor, where m is the number of enabled output ports and n is the number of enabled input ports.

A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.

An amplifier including a signal input terminal, at least one signal output terminal, a first and a second cascode amplifier circuits, a capacitor and a loading circuit. The signal input terminal receives an input signal. The first cascode amplifier circuit includes a first and a second input terminals and a first and a second output terminals. The first input terminal coupled to the signal input terminal receives the input signal. The second cascode amplifier circuit includes a third and a fourth input terminals and a third output terminal. The third input terminal is coupled to the first output terminal, and the third output terminal is coupled to the second input terminal. Two terminals of the capacitor are coupled to the fourth input terminal and the first output terminal respectively. A terminal of the loading circuit is coupled to the third output terminal, and another terminal of the loading circuit is coupled to the second output terminal. At least one of two terminals of the loading circuit is further coupled to the at least one signal output terminal.

A multiple-stage amplifier includes a driver stage die and a final stage die. The driver stage die includes a first type of semiconductor substrate (e.g., a silicon substrate), a first transistor, and an integrated portion of an interstage impedance matching circuit. A control terminal of the first transistor is electrically coupled to an RF signal input terminal of the driver stage die, and the integrated portion of the interstage impedance matching circuit is electrically coupled between a current-carrying terminal of the first transistor and an RF signal output terminal of the driver stage die. The second die includes a III-V semiconductor substrate (e.g., a GaN substrate) and a second transistor. A connection, which is a non-integrated portion of the interstage impedance matching circuit, is electrically coupled between the RF signal output terminal of the driver stage die and an RF signal input terminal of the final stage die.

Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.