Filter circuits having a resonator-based filter and a magnetically-coupled filter are disclosed. A filter circuit is deployed with a resonator-based passband filter connected to a magnetically-coupled filter which mitigates or reduces flyback of the resonator-based filter. The magnetically-coupled filter can be a passband filter with a relatively low insertion loss. The magnetically-coupled filter can be designed to mitigate flyback of the resonator-based filter by attenuating frequency response at selected frequency ranges.

The present disclosure provides an inductive element capable of lowering a Q-value. An inductive element includes a first cover and a second cover covering an annular core, and a first winding and a second winding wound around a region of the core, the first cover and the second cover. The first cover covers a part of an inner circumferential surface of the core, a part of an outer circumferential surface and an end surface on one end side in an axial direction. The second cover covers a part of the inner circumferential surface of the core, a part of the outer circumferential surface an end surface on the other end side in the axial direction.

A filter for suppressing 5G signal interference comprises a high-frequency filter circuit that uses a coil hung and disposed in a conductive isolating cavity as an inductor and that uses a combination of the conductive isolating cavity, dielectrics in the conductive isolating cavity, and the coil as a capacitor. A new-type filter circuit comprises a conductive isolating cavity, dielectrics in the conductive isolating cavity, and a coil hung and disposed in the conductive isolating cavity. The coil itself is an inductor in a high-frequency filter circuit, the coil and the conductive isolating cavity further form two conductors close to each other, and air media in relatively small space between the two conductors form non-conductive insulated media, to jointly form a new-type capacitor. That is, the coil in the high-frequency filter circuit is both an inductor and a conductor that forms a capacitor.

A filter radio frequency module packaging structure and a method for manufacturing same is disclosed. A first filter chip of the filter radio frequency module packaging structure comprises a chip main body and a wall structure. The wall structure, the functional surface, and a substrate together define a closed cavity, or the wall structure and the functional surface together define a closed cavity. An encapsulation material wraps the first filter chip.

A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

Examples include an inductor assembly and an apparatus comprising and a transistor amplifier and an impedance matching network. The impedance matching network comprises a circuit board, an inductance block and a screw. The inductance block has a first leg mounted on a first contact plate of the circuit board and a second leg mounted on a second contact plate of the circuit board. The screw is screwable into the inductance block such that a threaded portion of the screw engages with threaded portions of the first leg and the second leg to form a conductive path connecting the first contact plate with the second contact plate. The length of the conductive path and a value of the inductance of the conductive path are adjustable by adjusting a height of the screw within the inductance block.

Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

According to some embodiments, an on-chip diplexer circuit is disclosed. The on-chip diplexer circuit includes a LC resonator module, the LC resonator module further comprises a first port, a first LC resonator unit and a second LC resonator unit; a first filter unit, the first filter unit is electrically connected to the first LC resonator unit in the LC resonator module, and the first filter unit is electrically connected to a second port; and a second filter unit, the second filter unit is electrically connected to the second LC resonator unit in the LC resonator module, and the second filter unit is electrically connected to a third port. According to some embodiments, the first LC resonator unit serves as an impedance matching circuit for a first signal having a first resonant frequency and serves as an open circuit for a second signal having a second resonant frequency that is different from the first resonant frequency; the second LC resonator unit serves as an impedance matching circuit for the second signal having the second resonant frequency and serves as an open circuit for the first signal having the first resonant frequency. The first filter unit passes signals with the first resonant frequency; and the second filter unit passes signals with the second resonant frequency.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

An electromagnetic wave shielding material is provided that is configured to prevent a usage environment from being limited. The electromagnetic wave shielding material shields an electromagnetic wave having a frequency, and includes a substrate and a plurality of resonance loops disposed on the substrate. Moreover, the plurality of resonance loops are positioned on the substrate to be magnetically coupled to each other. Each of the resonance loops forms an LC parallel resonance circuit that resonates at the frequency of the electromagnetic wave.