A filter circuit includes a filter that is disposed on a path connecting a common terminal and an input output terminal and uses a first frequency band as a pass band, a filter that is disposed on a path connecting the common terminal and an input output terminal and uses a second frequency band different from the first frequency band as a pass band, and a phase adjustment circuit that has an input terminal connected to the path and an output terminal connected to the path, and adjusts a phase of a signal in the first frequency band input from the path and outputs a signal having a phase different from a phase of the signal in the first frequency band to the output terminal, wherein the path and the path are paths through which a received signal passes.

Quadrature error correction (QEC) for radio transceivers are provided herein. In certain embodiments, a transceiver includes an in-phase (I) signal path including a first controllable amplifier coupled to a first data converter, and a quadrature-phase (Q) signal path including a second controllable amplifier coupled to a second data converter. The transceiver further includes a QEC circuit operable to correct for a quadrature error between the I signal path and the Q signal path by adjusting a gain of the first controllable amplifier and/or a gain of the second controllable amplifier.

The nonlinearity of power amplifiers (PAs) has been a severe constraint in performance of modern wireless transceivers. This problem is even more challenging for the fifth generation (5G) cellular system since 5G signals have extremely high peak to average power ratio. Non-linear equalizers that exploit both deep neural networks (DNNs) and Volterra series models are provided to mitigate PA nonlinear distortions. The DNN equalizer architecture consists of multiple convolutional layers. The input features are designed according to the Volterra series model of nonlinear PAs. This enables the DNN equalizer to effectively mitigate nonlinear PA distortions while avoiding over-fitting under limited training data. The non-linear equalizers demonstrate superior performance over conventional nonlinear equalization approaches.

A semiconductor integrated circuit includes a substrate including a first wiring layer and a second wiring layer that is separated from the first wiring layer in a stacking direction, and an equalization circuit formed on the substrate to amplify a signal level of a part of a frequency bandwidth included in a differential input signal including a first signal and a second signal, and output a differential output signal including a third signal and a fourth signal, in which the equalization circuit includes a first transistor, a first inductor element, a second transistor, and a second inductor element, each of the first inductor element and the second inductor element has a first inductor portion, a second inductor portion, and a third inductor portion, the first inductor portion and the second inductor portion include single-layer winding coils, a third end portion of the third inductor portion is electrically connected to a first end portion of the first inductor portion, and a fourth end portion of the third inductor portion is electrically connected to a second end portion of the second inductor portion.

A power supply includes an inverter configured to convert direct current (DC) power into alternating current (AC) power, an impedance matching circuit configured to supply the AC power to a load, and a controller configured to detect a delay time of an output voltage and an output current output to the impedance matching circuit and the load and to adjust a frequency of the output voltage according to the detected delay time.

A power supply includes an inverter configured to convert direct current (DC) power into alternating current (AC) power, an impedance matching circuit configured to supply the AC power to a load, and a controller configured to detect a delay time of an output voltage and an output current output to the impedance matching circuit and the load and to adjust a frequency of the output voltage according to the detected delay time.

One example includes an equalizer system. The system includes a filter system configured to receive digital sample blocks associated with an input signal and to provide equalized digital sample blocks associated with the respective digital sample blocks based on adaptive tap weights. Each of the digital sample blocks includes samples and each of the equalized digital sample blocks includes equalized samples. The system also includes a sample set selector to select a subset of equalized samples from each of the equalized digital sample blocks at the output of the filter and an error estimator configured to implement an error estimation algorithm on the subset of the equalized samples to determine a residual error associated with the equalized samples. The system further includes a tap weight generator configured to generate the adaptive tap weights in response to the residual error and to provide the adaptive tap weights to the filter.

Implementation of large temperature-insensitive resistance in CMOS using short-duty-clock cycle is provided herein. Operations of a method can comprise boosting a resistance level of a switched-resistor circuit to a defined resistance level. The boosting can comprise using a short-duty-cycle clock to facilitate the boosting. Also provided is a sensor system that can comprise a short-duty-cycle clock and a switched-resistor circuit. The short-duty cycle clock boosts a resistance level of the switched-resistor circuit to a defined resistance level.

An integrated circuit (IC) device includes a first resistive strip having an input terminal and an output terminal. The IC device further includes a second resistive strip having a terminal coupled to a voltage. The second resistive strip may be coplanar with the first resistive strip. The IC device further includes a capacitor formed by the first resistive strip and the second resistive strip.

An integrated circuit (IC) device includes a first resistive strip having an input terminal and an output terminal. The IC device further includes a second resistive strip having a terminal coupled to a voltage. The second resistive strip may be coplanar with the first resistive strip. The IC device further includes a capacitor formed by the first resistive strip and the second resistive strip.