A circuit for reducing collector-emitter voltage (V.sub.CE) overshoot in an insulated gate bipolar transistor (IGBT) is provided. The circuit includes circuitry operable to generate a pulse which has a rising edge synchronized to the moment when collector or emitter current of the IGBT begins to fall during turn-off of the IGBT and a width which is a fraction of a duration of the V.sub.CE overshoot. The circuitry is further operable to combine the pulse with a control signal applied to a gate of the IGBT so as to momentarily raise the gate voltage of the IGBT during turn-off of the IGBT to above a threshold voltage of the IGBT for the duration of the pulse. A corresponding method of reducing V.sub.CE overshoot in an IGBT also is provided.

It is an object to provide a display device which can favorably display a image without delayed or distorted signals. The display device includes a first gate driver and a second gate driver. The first gate driver and the second gate driver each include a plurality of flip flop circuits and a plurality of transfer signal generation circuits. Both the flip flop circuit and the transfer signal generation circuit are circuits which output a signal inputted to a first input terminal with a half clock cycle delay. In addition, an output terminal of the transfer signal generation circuit is directly connected to a first input terminal of the flip flop circuit in the next stage. Therefore, delay and distortion of the signal which is inputted from the transfer signal generation circuit to the flip flop circuit can be reduced.

A static transfer switch is provided for supplying power to a load alternately from two different power sources. Switching between the two power sources may occur within a fraction of one electrical cycle. In response to sensing degraded performance in the power source supplying the load, resonant turn off circuits connected directly to the main switches of two phases of the power source are actuated to commutate the respective main switches. The main switch of the third phase is commutated with one or more of the resonant turn off circuits through the delta side of a transformer connected to the three phases of the power source.

Some demonstrative embodiments include a Metal-Oxide-Semiconductor (MOS) transistor including a split-gate structure. For example, an Integrated Circuit (IC) may include a MOS including a body; a source; a drain; and a split-gate structure including a control gate and at least one voltage-controlled Field-Plate (FP), the control gate is between the source and the voltage-controlled FP, the voltage-controlled FP is between the control gate and the drain, the control gate configured to switch the MOS transistor between an on state and an off state according to a switching voltage; and a voltage controller configured to apply a variable control voltage to the voltage-controlled FP, the variable control voltage based on at least one control parameter, the at least one control parameter including at least one of a load current driven by the MOS transistor or a switching frequency of the switching voltage.

Some demonstrative embodiments include a Metal-Oxide-Semiconductor (MOS) transistor including a split-gate structure. For example, an Integrated Circuit (IC) may include a MOS including a body; a source; a drain; and a split-gate structure including a control gate and at least one voltage-controlled Field-Plate (FP), the control gate is between the source and the voltage-controlled FP, the voltage-controlled FP is between the control gate and the drain, the control gate configured to switch the MOS transistor between an on state and an off state according to a switching voltage; and a voltage controller configured to apply a variable control voltage to the voltage-controlled FP, the variable control voltage based on at least one control parameter, the at least one control parameter including at least one of a load current driven by the MOS transistor or a switching frequency of the switching voltage.

A circuit and method for controlling charge injection in a circuit are disclosed. In one embodiment, the circuit and method are employed in a semiconductor-on-insulator (SOI) Radio Frequency (RF) switch. In one embodiment, an SOI RF switch comprises a plurality of switching transistors coupled in series, referred to as “stacked” transistors, and implemented as a monolithic integrated circuit on an SOI substrate. Charge injection control elements are coupled to receive injected charge from resistively-isolated nodes located between the switching transistors, and to convey the injected charge to at least one node that is not resistively-isolated. In one embodiment, the charge injection control elements comprise resistors. In another embodiment, the charge injection control elements comprise transistors. A method for controlling charge injection in a switch circuit is disclosed whereby injected charge is generated at resistively-isolated nodes between series coupled switching transistors, and the injected charge is conveyed to at least one node of the switch circuit that is not resistively-isolated.

A semiconductor switch device includes a switchable power semiconductor and a control circuit. The semiconductor switch device has a current sink and a current amplifier designed to amplify during a switching process a partial current of the total current flowing across the control capacitor that is not discharged by the current sink up to an adjustable maximum current and to apply the amplified partial current to the control electrode of the power semiconductor so as to counteract the change in the voltage across the collector-emitter path or the drain-source path of the power semiconductor during the switching process. An additional circuit provides an adapted switch-on transition by smoothing the collector voltage and/or the drain voltage of the switchable power semiconductor when switching over the collector-emitter path or the drain-source path of the power semiconductor from a blocked state into a conductive state.

A semiconductor switch device includes a switchable power semiconductor and a control circuit. The semiconductor switch device has a current sink and a current amplifier designed to amplify during a switching process a partial current of the total current flowing across the control capacitor that is not discharged by the current sink up to an adjustable maximum current and to apply the amplified partial current to the control electrode of the power semiconductor so as to counteract the change in the voltage across the collector-emitter path or the drain-source path of the power semiconductor during the switching process. An additional circuit provides an adapted switch-on transition by smoothing the collector voltage and/or the drain voltage of the switchable power semiconductor when switching over the collector-emitter path or the drain-source path of the power semiconductor from a blocked state into a conductive state.

It is an object to provide a display device which can favorably display a image without delayed or distorted signals. The display device includes a first gate driver and a second gate driver. The first gate driver and the second gate driver each include a plurality of flip flop circuits and a plurality of transfer signal generation circuits. Both the flip flop circuit and the transfer signal generation circuit are circuits which output a signal inputted to a first input terminal with a half clock cycle delay. In addition, an output terminal of the transfer signal generation circuit is directly connected to a first input terminal of the flip flop circuit in the next stage. Therefore, delay and distortion of the signal which is inputted from the transfer signal generation circuit to the flip flop circuit can be reduced.

A circuit and method for controlling charge injection in a circuit are disclosed. In one embodiment, the circuit and method are employed in a semiconductor-on-insulator (SOI) Radio Frequency (RF) switch. In one embodiment, an SOI RF switch comprises a plurality of switching transistors coupled in series, referred to as “stacked” transistors, and implemented as a monolithic integrated circuit on an SOI substrate. Charge injection control elements are coupled to receive injected charge from resistively-isolated nodes located between the switching transistors, and to convey the injected charge to at least one node that is not resistively-isolated. In one embodiment, the charge injection control elements comprise resistors. In another embodiment, the charge injection control elements comprise transistors. A method for controlling charge injection in a switch circuit is disclosed whereby injected charge is generated at resistively-isolated nodes between series coupled switching transistors, and the injected charge is conveyed to at least one node of the switch circuit that is not resistively-isolated.