A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

A method for feedforward noise cancellation in an enclosed space within a structure is provided. The method comprises placing a microphone array inside an inner surface of the enclosed space and conducting modal testing on an outside surface of the enclosed space, wherein the modal testing comprises multiple incoherent noise sources corresponding to locations of microphones in the microphone array. Noise generated by the modal testing is processed to create a number of acoustic mathematical models of the enclosed space. In response to incoherent noise within the enclosed space, a noise canceling signal is generated according to an output of the mathematical models.

A microphone circuit including a JFET or MOSFET transistor, a terminal of an input-impedance-network connected to the transistor's gate, one terminal of a source resistor connected to the transistor's source, and another terminal connected to ground, a bypass capacitor connected in parallel to the source resistor, one terminal of a load resistor connected to the transistor's drain, a charge-pump generating low-voltage connected to the second terminal of the load resistor, and an inverted voltage connected to a power supply terminal of an op amplifier, one input of the op-amplifier connected to the source terminal of the transistor through a bi-directional low-pass-filter, another input connected to a reference voltage, one power supply terminal connected to the inverted voltage, another power supply terminal connected to main supply voltage, an output terminal connected to another terminal of the input-impedance-network through a low pass filter, where the input-impedance-network connected to a microphone.

A microphone circuit including a JFET or MOSFET transistor, a terminal of an input-impedance-network connected to the transistor's gate, one terminal of a source resistor connected to the transistor's source, and another terminal connected to ground, a bypass capacitor connected in parallel to the source resistor, one terminal of a load resistor connected to the transistor's drain, a charge-pump generating low-voltage connected to the second terminal of the load resistor, and an inverted voltage connected to a power supply terminal of an op amplifier, one input of the op-amplifier connected to the source terminal of the transistor through a bi-directional low-pass-filter, another input connected to a reference voltage, one power supply terminal connected to the inverted voltage, another power supply terminal connected to main supply voltage, an output terminal connected to another terminal of the input-impedance-network through a low pass filter, where the input-impedance-network connected to a microphone.

A backplate assembly for a condenser microphone. The backplate may be coated with a parylene configured to help reduce the flatness deviation of the backplate across the diameter of the backplate. A plurality of openings may extend from the top portion of the backplate to the bottom portion of the backplate.

A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

Offset cartridge microphones are provided that include multiple unidirectional microphone cartridges mounted in an offset geometry. Various desired polar patterns and/or desired steering angles can be formed by processing the audio signals from the multiple cartridges, including a toroidal polar pattern. The offset geometry of the cartridges may include mounting the cartridges so that they are immediately adjacent to one another and so that their center axes are offset from one another. The microphones may have a more consistent on-axis frequency response and may more uniformly form desired polar patterns and/or desired steering angles by reducing the interference and reflections within and between the cartridges.

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

An acoustic sensor has a semiconductor substrate having an opening, a back plate that is disposed facing the opening of the semiconductor substrate, that is configured to function as a fixed electrode, and that has sound holes that allow passage of air, a vibration electrode film disposed facing the back plate through a void, and a casing configured to house the substrate, the back plate, and the vibration electrode film, and having a pressure hole that allows inflow of air. The acoustic sensor converts transformation of the vibration electrode film into a change in capacitance between the vibration electrode film and the back plate to detect sound pressure.