A layered film is formed in a display region of an active matrix substrate, and a single layer vapor deposition film is formed outside the display region of the active matrix substrate such that at least part of the single layer vapor deposition film does not overlap with a single layer vapor deposition film.

A layered film is formed in a display region of an active matrix substrate, and a single layer vapor deposition film is formed outside the display region of the active matrix substrate such that at least part of the single layer vapor deposition film does not overlap with a single layer vapor deposition film.

A method for manufacturing an organic device 10 according to an embodiment includes: a film forming step of continuously forming first to N-th layers (N is an integer of 2 or more) on a first electrode layer 14 formed on a main surface 12a of a flexible substrate while continuously conveying the flexible substrate 12, wherein in the film forming step, the first to N-th layers are sequentially formed on the first electrode layer by supplying materials of the first to N-th layers from first to N-th film forming sources to the flexible substrate through first to N-th shielding parts arranged between the first to N-th film forming sources and the flexible substrate, the first to N-th shielding parts are fixed in a conveyance direction of the flexible substrate in a state of being spaced apart from the flexible substrate, and a shielding area due to at least one shielding part of the first to N-th shielding parts is different from a shielding area due to other shielding part.

A method of manufacturing a display device includes a step of forming a first inorganic film constituting a sealing film and a step of forming an organic film constituting the sealing film. Between these steps, the method further includes a foreign matter inspection step of inspecting a substrate surface on which the first inorganic film has been formed and identifying the location of a foreign matter adhering to the substrate surface, and a partial ejection step of using an ink-jet method to eject ink to be formed a part of the organic film at the location of the foreign matter on the substrate surface identified in the foreign matter inspection step.

After an intermediate region and flexible substrate regions of a plastic film of a multilayer stack are divided from one another, the interface between the flexible substrate regions and a glass base is irradiated with laser light. The multilayer stack is separated into first and second portions while the multilayer stack is in contact with a stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate regions. The second portion includes the glass base and the intermediate region. The step of irradiating includes first and second laser light scanning. Irradiation intensity is modulated such that the irradiation intensity for at least part of the interface between the intermediate region and the glass base is lower than the irradiation intensity for the interface between the flexible substrate regions and the glass base.

A method of manufacturing a display device, the display device including, a substrate, a circuit element layer including a semiconductor layer, an insulation layer and a conducting layer, a bump part including at least one layer selected from the semiconductor layer, the insulation layer and the conducting layer forming the circuit element, and a sealing film, the method is provided including forming the circuit element layer in a display region of a plurality of display panels on a first surface above the substrate, forming the bump part in a boundary region of the plurality of display panels, forming the sealing film on approximately the entire surface of the plurality of display panels, and dividing the display panels at the bump part by cutting the substrate.

A method of manufacturing a display device, the display device including, a substrate, a circuit element layer including a semiconductor layer, an insulation layer and a conducting layer, a bump part including at least one layer selected from the semiconductor layer, the insulation layer and the conducting layer forming the circuit element, and a sealing film, the method is provided including forming the circuit element layer in a display region of a plurality of display panels on a first surface above the substrate, forming the bump part in a boundary region of the plurality of display panels, forming the sealing film on approximately the entire surface of the plurality of display panels, and dividing the display panels at the bump part by cutting the substrate.

Provided is a method for manufacturing an organic EL display device, including forming a sealing film to cover an organic EL element. The forming a sealing film includes forming a first inorganic layer to cover the organic EL element, forming a partition on the first inorganic layer, forming an organic layer on the first inorganic layer by applying an organic material inward from the partition on a surface of the first inorganic layer, removing the partition, and forming a second inorganic layer on the first inorganic layer to cover the organic layer.

An organic EL display device (100) includes an element substrate including a substrate, a plurality of organic EL elements supported by the substrate and respectively located in the plurality of pixels, and a bank layer (48) defining each of the plurality of pixels; and a thin film encapsulation structure (10) covering the plurality of pixels. The bank layer has an inclining surface enclosing each of the plurality of pixels. The thin film encapsulation structure includes a first inorganic barrier layer (12), an organic barrier layer (14) including a plurality of solid portions in contact with a top surface of the first inorganic barrier layer and distributed discretely, and a second inorganic barrier layer (16) in contact with the top surface of the first inorganic barrier layer and top surfaces of the plurality of solid portions of the organic barrier layer. The plurality of solid portions include pixel periphery solid portions (14a) each extending, on the first inorganic barrier layer, from a portion on the inclining surface to a peripheral area in the corresponding pixel of the plurality of pixels, the pixel periphery solid portions each extending along the entirety of a circumference of the pixel. A refractive index n0 of the organic barrier layer is smaller than a refractive index n1 of the second inorganic barrier layer, and the top surfaces of the pixel periphery solid portions each have an inclination angle a larger than, or equal to, 20 degrees.

According to a flexible OLED device production method of the present disclosure, a multilayer stack (100) is provided which includes a glass base (10), a functional layer region (20) including a TFT layer (20A) and an OLED layer (20B), and a synthetic resin film (30) provided between the glass base (10) and the functional layer region (20) and bound to the glass base (10). In a dry gas atmosphere whose dew point is not more than 50 C., the multilayer stack (100) is separated into a first portion (110) and a second portion (120), and a surface (30s) of the synthetic resin film (30) is exposed to the dry gas atmosphere, the first portion (110) including the functional layer region (20) and the synthetic resin film (30), the second portion (120) including the glass base (10). The first portion (110) is transported from the dry gas atmosphere to a reduced-pressure atmosphere R, and a protection layer (60) is formed on the surface (30s) of the synthetic resin film (30) in the reduced-pressure atmosphere R.