A leadwire for physiological patient monitoring is provided that transfers potentials received at a chest electrode to a data acquisition device. The leadwire includes an electrode end connectable to the chest electrode and a first conductive layer extending from the electrode end. The leadwire also has a device end connectable to a data acquisition device and a second conductive layer extending from the device end. The first conductive layer is galvanically isolated from the second conductive layer such that the first conductive layer and the second conductive layer form a capacitor.

A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.

An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

An inductor and a method of making an inductor. The inductor includes a stack of dielectric layers. The inductor also includes a plurality of metal levels comprising patterned metallic features of the inductor. Each metal level is located at an interface between adjacent dielectric layers in the stack. The patterned metallic features include a first plurality of inductor windings arranged in a substantially flat spiral in one of the metal levels. The patterned metallic features also include a second plurality of inductor windings in which each winding is located in a respective one of the plurality of metal levels. The first plurality of windings is connected in series with the second plurality of windings.

RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

A space efficient planar transformer can include a coupled inductor circuit that can include a metallic core, a first planar winding comprising a conductive coil having an electrical path encircling a first post of the metallic core, and a second planar winding configured to magnetically couple with the first winding via the metallic core. The second planar winding can have multiple portions. A portion of the second winding can include a first sub-portion comprising a single U-shaped planar conductive trace wrapped about the first post and a second sub-portion comprising a single U-shaped planar conductive trace wrapped about the first post. A layout of the first sub-portion can be oriented opposite a layout of the second sub-portion.

A printed circuit board of a planar transformer includes a first column hole, a second column hole, and a plurality of winding layers. At least one of the winding layers includes a first winding and a second winding connected in series. The first winding surrounds the first column hole and has a first opening direction. The second winding surrounds the second column hole and has a second opening direction. The first opening direction is different from the second opening direction. Consequently, the windings on the plurality of layers may be connected in series through conductive holes of the PCB to increase the number of winding turns.

A touch sensor pattern includes: a plurality of detection electrodes; a plurality of lead wires that are connected to the plurality of detection electrodes; and a plurality of external connection terminals that are connected to the plurality of lead wires, in which each of the plurality of external connection terminals includes a first fine metal wire having a smaller line width than each of the plurality of lead wires, and an area per unit length of at least a part of each of the plurality of external connection terminals in an extension direction in a plan view is 5.5 times or less an area per unit length of each of the plurality of lead wires in a plan view.

A semiconductor device includes: a first semiconductor chip including a first coil that generates a magnetic field signal; a wiring board including a second coil, a third coil, and a twisted pair wiring, the second coil being disposed to face the first coil and receiving the magnetic field signal generated by the first coil, the twisted pair wiring connecting the second coil with the third coil; and a second semiconductor chip including a fourth coil disposed to face the third coil and receiving a magnetic field signal generated by the third coil.