A camera includes: (a) a lens mount; (b) an image sensor for sensing images; and (c) a holder for fixedly holding the image sensor unmoveable relative to the lens mount at an aligned position after being aligned by gripping the image sensor.

The same or different camera includes: (a) a printed circuit board supporting a first circuit component; (b) a second printed circuit board; (c) a PCB holder for holding the printed circuit boards spaced apart from each other and pivotable relative to each other; and (d) a housing for enclosing the printed circuit boards and the PCB holder, the PCB holder being dimensioned for fastening to the housing such that the printed circuit boards are not parallel to each other and the first circuit component is placed in thermal communication with the housing.

Methods of installing the image sensor and an image processing assembly are provided.

A cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC is provided including: lifting a PCB and FPC to disengage from a lower carrier for suction positioning, recording coordinates by photographing marker points of two points on each single piece of PCB or FPC, comparing the same with absolute coordinates or relative coordinates of marker point coordinates on a solder paste printing steel plate photographed through a solder paste printer, performing compensation calculation and feeding back a signal to an XYθ calibration platform on each profiling sucker, lifting the PCB or the FPC to attach to the solder paste printing steel plate for solder paste printing, lowering the lifted platform, and moving the load to a lower workstation, and then covering the PCB or FPC with an upper steel sheet or an upper carrier.

A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism.

A camera includes: (a) a lens mount; (b) an image sensor for sensing images; and (c) a holder for fixedly holding the image sensor unmoveable relative to the lens mount at an aligned position after being aligned by gripping the image sensor.

The same or different camera includes: (a) a printed circuit board supporting a first circuit component; (b) a second printed circuit board; (c) a PCB holder for holding the printed circuit boards spaced apart from each other and pivotable relative to each other; and (d) a housing for enclosing the printed circuit boards and the PCB holder, the PCB holder being dimensioned for fastening to the housing such that the printed circuit boards are not parallel to each other and the first circuit component is placed in thermal communication with the housing.

Methods of installing the image sensor and an image processing assembly are provided.

An apparatus for manufacturing printing circuit boards is provided. The apparatus includes a microcontroller, power supply, two-dimensional stage, laser, and one or more chemical treatment tanks. The apparatus may include a mutlifunctional print module, or multiple independent modules capable of being exchanged, to perform various different processes on a substrate on the same build plate, and may include mechanical means for transporting the substrate during different stages between the build plate, chemical processing chamber(s), and a pressing chamber.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

An electronic component handler includes: a placing plate on which an electronic component can be placed; a camera which picks up an image of the placing plate; a light source of a laser beam which casts the laser beam on the placing plate; and a processor for determining whether the electronic component is placed on the placing plate or not and which controls working of the camera and the light source of the laser beam when the processor carries out determination. When determining whether the electronic component is placed on the placing plate or not, the processor causes the camera to pick up an image of the placing plate in a state where the light source of the laser beam is casting the laser beam on the placing plate, and determines whether the electronic component is placed or not, based on a boundary of luminance in the image.