A semiconductor device including a semiconductor chip disposed on a substrate having a conductive pattern, an insulating plate and a metal plate that are sequentially formed and respectively have the thicknesses of T2, T1 and T3. The metal plate has a plurality of depressions formed on a rear surface thereof. In a side view, a first edge face, which is an edge face of the conductive pattern, is at a first distance away from a second edge face that is an edge face of the metal plate, and a third edge face, which is an edge face of the semiconductor chip, is at a second distance away from the second edge face. Each depression is located within a depression formation distance from the first edge face, where: 0<depression formation distance≤(0.9×T1.sup.2/first distance), and/or (1.1×T1.sup.2/first distance)≤depression formation distance<second distance.

There is described is described a modular point-of-purchase display, system and method. The modular point of purchase display includes a back wall and a front wall, a bottom wall, at least one side wall, and at least one shelf. A printed electronic device is affixed to a surface of the back wall, the front wall, the bottom wall, the at least one side wall, and the at least one shelf. The display includes a microcontroller electrically coupled to the printed electronic device. The display includes a power supply electrically coupled to the printed electronic device. The display includes a connection device coupled to the printed electronic device. The display includes a modular component coupled to the connection device, wherein the modular component can be removed and replaced with an alternate modular component compatible with the connection device.

A method for producing a laminate that includes at least the following: providing a first intermediate laminate comprising a carrier substrate including a support therein and a peelable metal layer formed on at least one surface of the carrier substrate; forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support in the carrier substrate from a surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole; stacking and disposing on the surface where the first hole is formed of the second intermediate laminate, an insulating material and a metal foil in this order when viewed from the surface; and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction thereof with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material; and performing treatment with a chemical agent on the third intermediate laminate.

A method for mechanically connecting a first electronic component, in particular a circuit board element, to a second electronic component, in particular a second circuit board element, includes arranging and orienting the first electronic component, which includes a first through-opening in a first direction, above the second electronic component in the first direction in such a way that a second through opening in the first direction or a blind hole in the first direction is arranged at least partially below the first through-opening in the first direction. The method further includes introducing a casting compound into the first through-opening and into the second through-opening or into the first through-opening and into the blind hole, and setting the casting compound in order to fix the first electronic component in relation to the second electronic component.

A metal article characterized by including a metal substrate, a resin substrate, and a compound layer for bonding the metal substrate and resin substrate; the compound layer being a first compound layer including a first compound having a nitrogen-containing functional group and a silanol group, and a second compound which is an alkane-type amine-based silane coupling agent, and the first compound not containing sulfur atoms.

LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.

A component carrier, a method of manufacturing the same and a method of shielding a structural feature in a component carrier are disclosed. The component carrier includes a laminated stack with a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; an electrically insulating cap structure selectively covering a structural feature at an exterior surface of the laminated stack; and a shielding structure on the cap structure for shielding the structural feature.

A method of assembling a fastener structure on a plate body is introduced. The fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body combines with an assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

A fingerprint identification apparatus and an electrode device. The fingerprint identification apparatus could be configured to be disposed under a variety of different display screens, reducing a thickness of space for installation of the fingerprint identification apparatus under a screen. The fingerprint identification apparatus includes: a support plate; and at least one fingerprint sensor chip, the at least one fingerprint sensor chip being disposed at an upper surface of the support plate; where the support plate is configured to be mounted to an upper surface of a middle frame of the electronic device so that the at least one fingerprint sensor chip is located under the display screen of the electronic device; and the at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger on the display screen.