A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

A fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body, or both the body portion and the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body, or both the body portion and the fastening body combines with a assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

A conductive transfer for application to an article comprises first and second non-conductive layers and a conductive layer positioned between the two non-conductive layers. The conductive transfer further comprises an adhesive layer for adhering the conductive transfer to an article, such as a wearable item. The conductive layer comprises a plurality of tessellated cells defined by a printed conductive ink. The conductive layer comprises a main element and an input track with the plurality of tessellated cells being comprised over the input track of said conductive layer.

A method of assembling a fastener structure on a plate body is introduced. The fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body combines with an assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads (contacts), and a respective flexible integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising: providing (e.g. manufacturing) a flexible first structure comprising the plurality of first portions; providing (e.g. manufacturing) a second structure comprising the plurality of flexible ICs and a common support arranged to support the plurality of flexible ICs; dispensing an adhesive onto the first structure and/or onto the flexible ICs; transferring said flexible ICs from the common support onto the flexible first structure such that each group of terminals is mounted on (brought into electrical contact with) a respective group of contact pads to form an electronic circuit, providing a heated surface and an opposing surface together having a gap therebetween, transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion.

A fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body, or both the body portion and the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body, or both the body portion and the fastening body combines with a assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

A conductive transfer and method of producing the conductive transfer is described. The conductive transfer comprises two non-conductive layers and a conductive layer between the two non-conductive layers and at least one electrical component in electrical communication with the conductive layer. The conductive layer includes a power trace for providing a power source to the electrical component and a data trace for providing the electrical component with an electrical signal.

A flexible circuit comprises a laminated substrate, a layer of a protective coating, and first and second components. The laminated substrate comprises a support layer and a conductive layer arranged on the support layer. The conductive layer includes conductive traces. Edges of the conductive traces taper outwardly and towards the support layer. The layer of the protective coating is deposited on the conductive traces. The first component is soldered at a first connection point on one of the conductive traces. The soldering sublimates the protective coating. The second component is connected to the conductive layer at a second connection point. The second connection point is free of the protective coating.

A flexible circuit (FC) comprises a primary dielectric layer having a plurality of substantially parallel conductive circuit traces disposed therein and a secondary dielectric layer extending from or attached to the primary dielectric layer, wherein the secondary dielectric layer does not have any conductive circuit traces disposed therein, and wherein at least one of the primary and secondary dielectric layers defines an alignment feature for wrapping and securing the FC about a central structure. A method of wrapping and securing the FC about a central stricture comprises wrapping the FC about the central structure while aligning each alignment feature with a respective complimentary alignment feature such that the FC fully encompasses the central structure and is secured thereabout.