An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises thermally conductive material. The electronics enclosure system further includes at least one circuit board secured to an inner surface of a respective shell of the plurality of shells and a plurality of electronic components secured to the at least one circuit board, the plurality of shells, or some combination thereof.

An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises thermally conductive material. The electronics enclosure system further includes at least one circuit board secured to an inner surface of a respective shell of the plurality of shells and a plurality of electronic components secured to the at least one circuit board, the plurality of shells, or some combination thereof.

Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

A housing for an electronic circuit configuration includes a housing seal disposed on an inner surface of the housing, integrally bonded to at least one outer housing wall and made of a liquid silicone elastomer. An electrical connecting element extends from the interior of the housing through an outer housing wall and out of the housing. A space between the outer housing wall and the electrical connecting element is sealed by the housing seal.

In a ventilation mechanism of an electronic control device, a ventilation path is formed by a through hole and a window formed in a side surface of a projection projecting outward of a case, and entry of water into the ventilation path is prevented by a wall. A water-repellent filter is attached to an inner wall of the case, with a gap between the water-repellent filter and a bottom surface of the projection. The projection and the wall are integrated with the case. This achieves reduction in the number of components of the ventilation mechanism and improvement in machinability while ensuring a waterproof function.

In a ventilation mechanism of an electronic control device, a ventilation path is formed by a through hole and a window formed in a side surface of a projection projecting outward of a case, and entry of water into the ventilation path is prevented by a wall. A water-repellent filter is attached to an inner wall of the case, with a gap between the water-repellent filter and a bottom surface of the projection. The projection and the wall are integrated with the case. This achieves reduction in the number of components of the ventilation mechanism and improvement in machinability while ensuring a waterproof function.

A method of manufacturing a display device includes forming on a first substrate a display element and a metal layer surrounding the display element, the metal layer including a first portion having a first width and a second portion having a second width less than the first width, forming on a second substrate a sealing member surrounding the display element, the sealing member including a first sealing portion having a first forming width and a second sealing portion having a second forming width greater than the first forming width, arranging the first substrate and the second substrate such that the sealing member on the second substrate faces the first substrate, the first sealing portion overlaps the first portion of the metal layer, and the second sealing portion overlaps the second portion of the metal layer, and sealing the first and second substrates by melting and curing the sealing member.

A novel electronic device is provided. Alternatively, an electronic device of a novel embodiment is provided. Alternatively, a sturdy electronic device is provided. The electronic device includes a housing and a display portion having flexibility. The housing includes a first board, a second board, and a sealing portion. The first board has a light-transmitting property. The first board and the second board face each other. The sealing portion is between the first board and the second board. The first board has a first curved surface which forms the inside of the housing. The display portion includes a region in contact with the first curved surface.