In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

A surge protection circuit for an electronic device such as an HVAC controller. In one example, the surge protection circuit may include a first voltage clamp, a second voltage clamp, a resistor, and an output port. The first voltage clamp may provide a first clamping voltage between a power input terminal and a common terminal. The second voltage clamp may provide a second clamping voltage that is less than the first clamping voltage. The resistor may be connected in series with the second voltage clamp, and the series connected resistor and second voltage clamp may be connected in parallel with the first voltage clamp. As such, a surge current at the power input terminal may be split between the first voltage clamp and the second voltage clamp. The amount of surge current that is provided to the second voltage clamp may be set by the value of the resistor.

In a component mounting system, recovery processing is repeated until a recovery count number Nr is larger than or equal to a defined count number Nth in a case where a pickup defect of a component occurs, an elapsed time is measured from error stoppage of a component mounting machine to canceling of the error stoppage in which the component mounting machine is error-stopped when the recovery count number Nr is larger than or equal to the defined count number Nth, the defined count number Nth is increased within a range in which the defined count number does not exceed the upper limit value Nmax in a case where the elapsed time is shorter than a defined time Tth, and the defined count number Nth returns to an initial value in a case where the elapsed time is longer than or equal to the defined time Tth.

An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

A storage frame structure for an automatic depot includes: several space limiting units, each having a plug-in surface formed with vertical slots and two opposite ends, at least one of the opposite ends being formed with an insert hole; several fixing rods abutting with the limiting units respectively; two side plates connected to the fixing rods in such a manner that the fixing rods extend parallel to one another between the side plates; and two positioning plates, each having two opposite insert ends extending into the vertical slots of an adjacent pair of the limiting units, thereby defining a reception chamber therebetween to retain a material tray stably in the chamber. The storage frame structure has simple construction and is applicable in automation industry (like SMT electronic industry) for material storing and sorting.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.

An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.

An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.