A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.

A combination of batch exchange carts that includes all of the feeders that supply components to be used in the post-changeover production from the multiple batch exchange units prepared in preparation space is decided based on the component information of feeders loaded on batch exchange carts used in the pre-changeover production and setup information of batch exchange carts that can be used for exchange memorized in memory device (component information of feeders loaded on batch exchange carts in preparation space), and then an operator is notified of the decided combination of batch exchange carts by sound or by the display of a mobile terminal or display device of production management computer.

A mounting-related device includes an articulated robot that is disposed in a movable space formed between a first conveyance section and a second conveyance section, holds, and moves a processing target object such that a posture of a mounting surface can be changed, and the first conveyance section and the second conveyance section include a rail attachment section that can attach and detach a pair of rail devices bridged between the first conveyance section and the second conveyance section for moving a board when conveying the board.

An object of the present disclosure is to provide a component crimping device and a component crimping method that make it possible to improve accuracy of attaching a component onto a substrate by preventing the component from being excessively elongated due to rapid thermal expansion when the component is pressed against the substrate. A lower surface side of a substrate-side terminal part of a substrate held by a substrate holding table is supported by a support, a component placed on a placing table is picked up by a crimping head while heating the component, the component is compressed against a compressing table so as to be elongated, and then the component is pressed against the substrate-side terminal part.

A cut-and-clinch apparatus that cuts and bends protruding parts of two lead wires of a lead component to be respectively inserted through two of a plurality of through-holes formed in a circuit board, the cut-and-clinch apparatus includes a pair of movable elements that are used in a case where the respective protruding parts of the two lead wires are cut and bent and that are made to approach each other and separate from each other, and a movable element position control section that controls the positions of the pair of movable elements, on the basis of image data obtained by the pair of movable elements being imaged.

Disclosed is a panel transport tool including a plate member and an adhesive layer provided on the plate member and allowing a transported panel to be attached to and detached from the adhesive layer. The plate member includes a high floor portion holding the transported panel on a surface of the plate member via the adhesive layer, and a low floor portion having a surface below the surface of the high floor portion.

The present invention describe a substrate handling system that exerts no or controllable external forces to hold substrates, does not contact front or back of the substrates, has minimum contact with side edge area of the substrate, can hold one or two substrate to each position, can be positioned in any orientation, and can be easily handled by human or robots. In the case that no deposition materials is desirable on the edge or sides of substrate, a self-aligned mask that can be attached to the substrate carrier is presented.

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.

A board conveyance device and conveyance belt inspection method that enable easy detection of a problem with conveyance belts. The board conveyance device includes: endless conveyance belts on which is set a conveyance path for conveying a board; a board sensor configured to detect the presence of the board at a specified detection position on the conveyance path; and a control section configured to, in a case in which the board is not being conveyed on the conveyance path, move the conveyance belts and determine a problem with the conveyance belts based on a detection result of the board sensor.