A component mounting system includes a board transport line for transporting a board from an upstream to a downstream and a work station disposed in the board transport line and performing component mounting work.

The board transport line transports a board introduced in the downstream of the work station to the work station, and transports the board from the work station to the downstream when mounting of a component on the board is completed in the work station.

There is provided a component mounter including: a plurality of transport lanes for transporting a board sorted by a board sorting device; a congestion index calculator for calculating a congestion index indicating a congestion degree of each of the plurality of transport lanes; a transport lane determiner for determining a transport lane for carrying in the board among the plurality of transport lanes based on the calculated congestion index; and an outputter for outputting a board request signal for requesting to carry the board into the transport lane determined by the transport lane determiner, to the board sorting device.

A component mounter includes a head capable of picking a component, a board conveyance device that conveys a board, a backup device that backs up the board from a rear surface by using a backup pin, and an accommodation base on which the backup pin is placed. The backup device includes the backup pin and a backup plate having an installation surface on which the backup pin is installed and a through-hole penetrating the backup plate vertically such that the backup pin can be inserted. The accommodation base is disposed to be located under the through-hole, and the backup pin inserted through the through-hole is placed thereon.

A support pin arrangement determination assisting method includes displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on the already mounted surface; inputting an arrangement position of the support pin to the displayed image; and displaying a composite image in which a pin arrangement image indicating the input arrangement position is superimposed on the board image. A planar image of the support pin in the pin arrangement image includes an image of a top portion of a shaft and an image of a contact portion which is located on a tip side of the top portion, which has a sectional shape smaller than that of the top portion, and which contacts and supports a lower surface of the board.

A feeder management device and method for managing feeders when producing a board based on a production plan including a board conveyance device; a component supply device in which multiple feeders are detachably mounted at multiple installation positions; and an electronic component mounter including a component transfer device. The method including a current state memory step of linking and storing a current component type of the electronic components, being supplied by the currently mounted feeder, and a position of the mounted feeder; a plan memory step of linking and storing required component types of the electronic components, being mounted on the multiple types of boards, and a position of the feeder of supplying the required components; and a reel removal guide step to remove a first reel from a first feeder of supplying the electronic components of which current state component type does not match the required component types.

The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.

A board working device includes: a board conveyance device; multiple heads; and a control device which performs control such that a printed circuit board is positioned in multiple locations in order from an upstream side relative to the progress direction of the printed circuit board, and work performed using a first head of the multiple heads, and further, once the work is completed by the first head at the most downstream side position out of the multiple locations relative to the progress direction of the printed circuit board, performs control such that work is started using a second head of the multiple heads, with the work of the second head being performed with the printed circuit board being positioned in order from a downstream side position out of the multiple locations relative to the progress direction of the printed circuit board.

An assembly system that includes a robot adapted to grip an electronic device to be mounted on a circuit board, a first vision system that identifies a position and a posture of the electronic device gripped by the robot, a fixing device that fixe a plurality of circuit boards thereon, and a second vision system that identifies a position and a posture of the circuit board fixed on the fixing device. The robot mounts the gripped electronic device on a circuit board under the visual guidance of the first vision system and the second vision system. The view field of the second vision system is not capable of completely covering a surface region of all circuit boards fixed on the fixing device. The assembly system further includes a moving mechanism that moves the second vision system in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, so that the second vision system completes identification of all circuit boards on the fixing device step by step. With this assembly system, the robot complete the assembly work of all circuit boards at an assembly station. Also, a method of assembling a circuit board that mounts a gripped electronic device on a circuit board.

A soft back-up pin state checking device including a soft back-up pin formed of a bottom-side holder portion, and a top-side soft pin portion which is held by the holder portion in an exchangeable manner. A ring-shaped background portion which is possible to be distinguished from the soft pin portion and be recognized using image processing is provided on a top end surface of a cylindrical fitting portion which is outside of an outer circumference of the soft pin portion in the holder portion of the soft back-up pin.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.