A component mounting line control system controls a component mounting line. The component mounting line includes a component mounting device and a board retrieving unit. The component mounting line control system includes an acquirer and a controller. The acquirer acquires information from the board retrieving unit. The controller controls the component mounting device based on the information acquired by the acquirer. The controller lengthens a time taken for a manufacturing process in the component mounting device in a case where the acquirer acquires first warning information, which indicates that a board accommodation limit is about to be reached, from the board retrieving unit.

The embodiment of the present disclosure relates to a system and a method for loading and unloading a cassette. The system comprises: a lifting device vertically moving between a first height and a second height; a first conveying device in the lifting device to move the cassette horizontally; a second conveying device to move the cassette in horizontally; a third conveying device to move the cassette horizontally, a plurality of first position sensors to detect a position of the lifting device; and a control device to control vertical movements of the lifting device, and adjust further movements of the first conveying device in the lifting device based on an initial stop position of the lifting device such that the first conveying device is aligned with the second conveying device at the first height, or is aligned with the third conveying device at the second height.

A system, comprising: a conveyor to controllably move a substrate; a nozzle head controllably movable relative to the conveyor; an edge detector associated with the nozzle head to detect a leading edge of the substrate; and a control system coupled to the conveyor, nozzle head and edge detector to selectively and individually control both speed of the conveyor and position of the nozzle head relative to the conveyor in response to first and second leading edge detections to thereby position the substrate in a predetermined position for application of liquid flux by the nozzle head.

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

A printed board transport apparatus includes a first conveyor which transports a printed board between a working portion and printed board loading/unloading portions of a working apparatus, and a second conveyor installed in the printed board loading/unloading portions. The first conveyor has a function of rotating a first transport member, and a function of moving in a direction parallel to the transport direction. The second conveyor transports the printed board by rotating a second transport member. After the length of a downstream portion of the printed board, which is placed on a conveyor on the downstream side, has reached a support length, the first conveyor moves toward the working portion by changing the rotational speed of the first transport member to a rotational speed for conveyor movement.

A method for decreasing the number of assembly workstations, the method comprising the steps of providing a first workstation at a first location, supplied with power from a first power source; providing a product to the first workstation and supplying the product with power from the first power source; providing a second workstation at a second location, supplied with power from a second power source; transporting a product from the first workstation to the second workstation including disconnecting the first power source from the product in order to transport the product; connecting the product to the second power supply at the second workstation; the method further comprising the steps of: prior to supplying the product with power from the first power source placing the product in a device capable of supplying the product with power from a battery; disconnecting the first power source from the device; supplying the product from the battery, so that the product remains supplied with power between the disconnecting the first power source and connecting the product to the second power source.

A system for separating a workpiece from workpieces is provided. The system includes a stocker on which a plurality of workpieces are stored in a stacked state, a holding unit including at least one pair of inverted V-shaped pads that sandwich and clamp both ends of one of the workpieces, and a moving unit that moves at least one of the holding unit and the stocker so as to relatively move the stocker downward with respect to the holding unit, which is in a state where the one of the workpieces is clamped by the at least one pair of pads, and to separate the one of the workpieces from other workpieces.

Method for decreasing the number of assembly workstations, comprising: providing a first workstation at a first location, supplied with power from a first source; providing a product to the first workstation and supplying the product with power from the first source; providing a second workstation at a second location, supplied with power from a second source; transporting the product from the first workstation to the second workstation including disconnecting the first source from the product; connecting the product to the second power supply at the second workstation and, before supplying the product with power from the first source, placing the product in a device capable of supplying the product with battery power; disconnecting the first source from the device; and supplying the product with battery power, so that the product remains supplied with power between disconnecting the first source and connecting the product to the second source.

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).

A component mounting device includes a heater unit which heats a range which is narrower than a movement range of a head which is a partial range of a board using a heater, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.