A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of a AgCu eutectic structure layer (32) is set to 15 m or less.

Various embodiments include a method for producing a structural unit to be soldered to a component by diffusion soldering and formed independently of the component comprising: providing a substrate; applying a paste with both metal particles and solder particles different from the metal particles onto at least one subregion of the substrate using a printing technique; and infiltrating the paste with solder in absence of the component, wherein the paste infiltrated with the solder forms a solder carrier layer. The solder infiltrating the paste is applied as at least one inherently rigid shaped part. A surface topography of the paste is modified by a stamp on the substrate.

An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

Provided herein are power converter of a drive unit for an electric vehicle. The power converter includes an inverter having a first transistor, a second transistor, and a capacitor, and a laminated bus-bar having a positive bus-bar segment, a negative bus-bar segment and a phase bus-bar segment. The positive bus-bar segment, the negative bus-bar segment, and the phase bus-bar segment can be disposed about the capacitor to form a lead frame coupled with the capacitor. The lead frame can include a first lead coupled with the first transistor. The first lead can include portions of the positive bus-bar segment and the phase bus-bar segment. The lead frame can include a second lead coupled with the second transistor. The second lead can include portions of the negative bus-bar segment and the phase bus-bar segment.

Provided herein are power converter of a drive unit for an electric vehicle. The power converter includes an inverter having a first transistor, a second transistor, and a capacitor, and a laminated bus-bar having a positive bus-bar segment, a negative bus-bar segment and a phase bus-bar segment. The positive bus-bar segment, the negative bus-bar segment, and the phase bus-bar segment can be disposed about the capacitor to form a lead frame coupled with the capacitor. The lead frame can include a first lead coupled with the first transistor. The first lead can include portions of the positive bus-bar segment and the phase bus-bar segment. The lead frame can include a second lead coupled with the second transistor. The second lead can include portions of the negative bus-bar segment and the phase bus-bar segment.

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.