A device for converting radiation to electrical energy having a hybrid interface structure comprising an etched silicon surface and organic layer connected thereto. The invention provides methods for the preparation of said etched silicon surface and said hybrid interface.

A multifunctional composite panel and a system for fabricating the multifunctional composite panel are disclosed. The multifunctional composite panel may include a plurality of structural layers and a plurality of photovoltaic layers disposed adjacent the plurality of structural layers. The structural layers may include a plurality of alternating layers where each of the alternating layers includes a first layer and a second layer. The first layer may include one or more polymers and the second layer may include one or more inorganic materials. The system for fabricating the multifunctional composite panel may include a based configured to support the multifunctional composite panel and a plurality of application heads disposed proximal the based and configured to form layers of the multifunctional composite panel.

Provided is an organic electroluminescent device. The organic electroluminescent device comprises a first electrode, a second electrode, and at least two light emitting units disposed between the first electrode and the second electrode, wherein the light emitting units each comprises at least one light emitting layer, and a connection layer of a specific structure is further disposed between adjacent two light emitting units. By using a connection layer of a specific structure, the organic light-emitting device reduces the device voltage, prolongs life time of the device, and improves the device performance.

The present disclosure relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device. The display panel includes a display substrate and an encapsulation layer for encapsulating the display substrate. The encapsulation layer includes at least one inorganic composite film layer, and each inorganic composite film layer includes an inorganic matrix and an inorganic filler. The inorganic matrix includes a plurality of grains spaced apart by gaps, and the inorganic filler is capable of enclosing each grain and being filled in a gap between every two adjacent grains.

A manufacturing method of an organic electronic device of the present invention, includes: a removing step of removing a volatile component from a flexible base material; a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer; and a forming step of forming a device main body sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order, in which a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20 C. to a melting point of a parent resin of the flexible base material.

A method for fabricating a multifunctional composite panel is disclosed. The method can include forming a plurality of structural layers, and forming a plurality of photovoltaic layers adjacent the plurality of structural layers. Forming the plurality of structural layers can include forming alternating layers of a conductive organic material and an inorganic material. Forming the alternating layers can include forming a first layer from the conductive organic material, and forming a second layer adjacent the first layer from the inorganic material. The multifunctional composite panel can have a thickness of from about 1 mm to about 30 mm.

Methods of making an integrated circuit for a single-molecule nucleic-acid assay platform. In one example, the method includes adhering a carbon nanotube to a surface of a transfer film, the transfer film comprising gold or a polymer; placing the surface of the transfer film on a CMOS integrated circuit; releasing the carbon nanotube from the transfer film; and forming a pair of post-processed electrodes proximate opposing ends of the carbon nanotube, the post-processed electrodes electrically connecting the carbon nanotube to the CMOS integrated circuit. The method can also include exposing the carbon nanotube to a diazonium salt solution to form a point defect on a portion of the carbon nanotube.

Disclosed is a building blocks method for low-cost fabrication of single crystal organometallic perovskite materials with pseudo crystallized hole transporting material layer. This method uses self-assembled molecular monolayers SAM as building blocks. This approach enables creation of defect-free perovskite crystals with desired morphology and crystallinity in a controlled way. Additionally, the crosslinked molecular layers SAM play a role of hole transporting materials HTM and encapsulation against diffusion of metal atoms and gas molecules, thus enhancing the stability of the perovskite materials. This method is cost effective and can be scaled up.

A deposition mask includes a metal mask body in which a deposition opening is defined; and a coating layer including aluminum oxynitride, on an outer surface of the metal mask body.

Disclosed are a memristor device, a method of fabricating the same, a synaptic device including a memristor device, and a neuromorphic device including a synaptic device. The disclosed memristor device may comprise a first electrode, a second electrode disposed to be spaced apart from the first electrode; and a resistance changing layer including a copolymer between the first electrode and the second electrode. The copolymer may be a copolymer of a first monomer and a second monomer, and the first polymer formed from the first monomer may have a property that diffusion of metal ions is faster than that of the second polymer formed from the second monomer. The second polymer may have a lower diffusivity of metal ions as compared with the first polymer. The first monomer may include vinylimidazole (VI). The second monomer may include 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane (V3D3). The copolymer may include p(V3D3-co-VI).