The disclosed subject matter relates generally to semiconductor devices. More particularly, the present disclosure relates to Hall effect devices integrated with junction transistors to achieve tunable parameters within the Hall effect devices. The present disclosure also relates to methods of forming the Hall effect devices.

A semiconductor device, includes: a semiconductor substrate having first and second main surfaces; and first and second polysilicon layers doped with impurity, wherein the semiconductor substrate includes a diffusion layer doped with impurity, the diffusion layer is located between the first main surface and the second main surface, first and second grooves are formed on the first main surface in spaced-apart relationship along a first direction in a plan view, the first and second grooves each extend along a second direction orthogonal to the first direction in a plan view and extend toward the second main surface to reach the diffusion layer in a cross-sectional view orthogonal to the second direction, the first and second polysilicon layers are embedded in the first and second grooves, respectively, and lower ends of the first and second polysilicon layers are electrically connected to each other by the diffusion layer.

A semiconductor device includes an electronic circuit, an interconnection contact such as a solder ball, and a plate configured to concentrate magnetic flux to a predetermined area. The plate is electrically conductive, and it is electrically connected to the electronic circuit.

A semiconductor sensor structure is provided which has a top side and a bottom side and includes a first semiconductor wafer, a second semiconductor wafer, and an insulating layer. The second semiconductor wafer includes a substrate layer having an integrated circuit, formed on the front side, with at least one metal terminal contact formed on the front side. The front side of the second semiconductor wafer and a front side of the first semiconductor wafer are each formed on the insulating layer. The first semiconductor wafer has a semiconductor layer with a three-dimensional Hall sensor structure having a sensor area formed of a monolithic semiconductor body and extending from the backside to the front side of the semiconductor layer. At least three mutually spaced apart first metal terminal contacts are on the front side and at least three mutually spaced apart second metal terminal contacts are on the backside.

An SOI semiconductor structure, including a substrate layer formed on a back side and a semiconductor layer of a second conductivity type formed on a front side, an insulating layer being disposed between the substrate layer and the semiconductor layer, a three-dimensional Hall sensor structure having a sensor region made up of a monolithic semiconductor body being formed in the semiconductor layer, and the semiconductor body extending from an underside up to the front side, at least three first metallic terminal contacts being formed on the upper side, and at least three second metallic terminal contacts being formed on the underside, the first terminal contacts being offset with respect to the second terminal contacts in a projection perpendicular to the front side, each first terminal contact and each second terminal contact being formed in each case on a highly doped semiconductor contact region of a second conductivity type.

A spin-orbit torque magnetoresistance effect element includes an element part including a first ferromagnetic layer, a second ferromagnetic layer, and a nonmagnetic layer positioned between the first ferromagnetic layer and the second ferromagnetic layer, a spin-orbit torque wiring positioned in a first direction with respect to the element part, facing the first ferromagnetic layer of the element part, and extending in a second direction, a first conductive part and a second conductive part facing the spin-orbit torque wiring at positions sandwiching the element part when viewed from the first direction, and a gate part including a gate insulating layer and a gate electrode in order from a position near the spin-orbit torque wiring, in which the spin-orbit torque wiring includes a semiconductor to which a scattering element is added.

A Hall effect sensor device may be provided, including one or more sensor structures. Each sensor structure may include: a base layer having a first conductivity type; a Hall plate region having a second conductivity type opposite from the first conductivity type arranged above the base layer; a first isolating region arranged around and adjoining the Hall plate region, and contacting the base layer; a plurality of second isolating regions arranged within the Hall plate region; and a plurality of terminal regions arranged within the Hall plate region. The first and second isolating regions may include electrically insulating material, and each neighboring pair of terminal regions may be electrically isolated from each other by one of the second isolating regions.

The semiconductor device includes a magnetic switch provided to a semiconductor substrate. The magnetic switch includes: a horizontal Hall element including first electrodes and second electrodes arranged at positions perpendicular to the first electrodes; a switch circuit configured to select a drive current direction of the Hall element from four directions; an SH comparator configured to alternately perform a first operation for sampling a signal transmitted from the Hall element and a second operation for sending a signal which is based on a result of comparing a value of the sampled signal and a reference value; a latch circuit configured to hold this sent signal and send the held signal as a latch output signal; and a control circuit configured to select the drive current direction in each of a period for the first operation and a period for the second operation based on the latch output signal.

A device having a Hall effect sensor is provided. The Hall effect sensor includes a sensor well and a Hall plate disposed within the sensor well. The Hall plate includes a first current terminal and a second current terminal configured to flow a current through the Hall plate, and the Hall plate further includes a first sensing terminal and a second sensing terminal configured to sense a Hall voltage. A separation layer and a separation well are disposed within the sensor well, as well as surround the Hall plate and isolate the Hall plate. At least one of a current sensitivity and a resistance of the Hall effect sensor is tunable based on an adjustable thickness of the Hall plate. The thickness of the Hall plate is adjustable based at least in part on implants in the separation layer and/or a bias voltage applied to the separation layer.

A magnetic sensor has a Hall IC that has a Hall element formed on a surface of the Hall IC, and a lead frame that supports the Hall IC. The lead frame includes a first region that is disposed in the vicinity of the Hall element and generates a first magnetic field due to a first eddy current generated when a measurement target magnetic field is applied, and second regions that are disposed away from the first region and generate a second magnetic field having an intensity that cancels the first magnetic field by means of second eddy currents generated when the measurement target magnetic field is applied.