Methods, systems, and devices for decoding for a memory device are described. A decoder may include a first vertical n-type transistor and a second vertical n-type transistor that extends in a third direction relative to a die of a memory array. The first vertical n-type transistor may be configured to selectively couple an access line with a source node and the second n-type transistor may be configured to selectively couple the access line with a ground node. To activate the access line coupled with the first and second vertical n-type transistors, the first vertical n-type transistor may be activated, the second vertical n-type transistor may be deactivated, and the source node coupled with the first vertical n-type transistor may have a voltage applied that differs from a ground voltage.

A variable resistance memory device includes: a memory cell including a first and second sub memory cell; and a first, second and third conductor. The first sub memory cell is above the first conductor, and includes a first variable resistance element and a first bidirectional switching element. The second sub memory cell is above the second conductor, and includes a second variable resistance element and a second bidirectional switching element. The second conductor is above the first sub memory cell. The third conductor is above the second sub memory cell. The variable resistance memory device is configured to receive first data and to write the first data to the memory cell when the first data does not match second data read from the memory cell.

A memory cell with hard mask insulator and its manufacturing methods are provided. In some embodiments, a memory cell stack is formed over a substrate having a bottom electrode layer, a resistance switching dielectric layer over the bottom electrode layer, and a top electrode layer over the resistance switching dielectric layer. A first insulating layer is formed over the top electrode layer. A first metal hard masking layer is formed over the first insulating layer. Then, a series of etch is performed to pattern the first metal hard masking layer, the first insulating layer, the top electrode layer and the resistance switching dielectric layer to form a first metal hard mask, a hard mask insulator, a top electrode, and a resistance switching dielectric.

A method of producing a recurrent neural network computer includes consecutive steps of providing a substrate with a first electrode; structuring the first electrode by etching using a first mask made of block copolymers, such that said electrode has free regions which are randomly spatially distributed; forming a resistive-RAM-type memory layer on the first structured electrode; forming a second electrode on the memory layer; and structuring the second electrode by etching, using a second mask made of block copolymers such that said electrode has free regions which are randomly spatially distributed.

A 3D semiconductor device including: a first single crystal layer with first transistors; overlaid by a first metal layer; a second metal layer overlaying the first metal layer and being overlaid by a third metal layer; a logic gates including at least the first metal layer interconnecting the first transistors; second transistors disposed atop the third metal layer; third transistors disposed atop the second transistors; a top metal layer disposed atop the third transistors; and a memory array including word-lines, and at least four memory mini arrays, where each of the memory mini arrays includes at least four rows by four columns of memory cells, where each of the memory cells includes at least one of the second transistors or third transistors, sense amplifier circuit(s) for each of the memory mini arrays, the second metal layer provides a greater current carrying capacity than the third metal layer.

Disclosed is a synaptic device, a reservoir computing device using the synaptic device, and a reservoir computing method using the reservoir computing device. The synaptic device includes a substrate and a plurality of units cells on the substrate, wherein the unit cells each include a channel layer and a first electrode and second electrode intersecting the channel layer, wherein the first electrode and the second electrode are spaced apart from each other, and define a gap region exposing a portion of the channel layer, and the channel layer includes a 2-dimensional semiconductor material or a 2-dimensional ferroelectric material.

A memory device includes: a first conductor extending in parallel with a first axis; a first selector material comprising a first portion that extends along a first sidewall of the first conductor; a second selector material comprising a first portion that extends along the first sidewall of the first conductor; a first variable resistive material comprising a portion that extends along the first sidewall of the first conductor; and a second conductor extending in parallel with a second axis substantially perpendicular to the first axis, wherein the first portion of the first selector material, the first portion of the second selector material, and the portion of the first variable resistive material are arranged along a first direction in parallel with a third axis substantially perpendicular to the first axis and second axis.

Thermal field controlled electrical conductivity change devices and applications therefore are provided. In some embodiments, a thermal switch, comprises: a metal-insulator-transition (MIT) material; first and second terminals electrically coupled to the MIT material; and a heater disposed near the MIT material.

A memory cell includes: a resistive material layer comprising a first portion that extends along a first direction and a second portion that extends along a second direction, wherein the first and second directions are different from each other; a first electrode coupled to a bottom surface of the first portion of the resistive material layer; and a second electrode coupled to the second portion of the resistive material layer.

A resistive random access memory (RRAM) device and a method for constructing the device is described. A capping layer structure is provided over a bottom contact where the capping layer includes a recess situated over the bottom contact. A first portion of the recess is filled with a lower electrode such that the width of the recess defines the width of the lower electrode. A second portion of the recess is filled with a high-K layer so that a bottom surface of the high-K layer has a stepped profile. A top electrode is formed on the high-K layer and a top contact is formed on the top electrode. The width of the high-K layer is greater than the width of the lower electrode to prevent shorting between the top contact and the lower electrode of the RRAM device.